HSINCHU, Sept. 7, 2023
/PRNewswire/ -- MediaTek and TSMC (TWSE: 2330, NYSE: TSM) today
announced that MediaTek has successfully developed its first chip
using TSMC's leading-edge 3nm technology, taping out MediaTek's
flagship Dimensity system-on-chip (SoC) with volume production
expected next year. This marks a significant milestone in the
long-standing strategic partnership between MediaTek and TSMC, with
both companies taking full advantage of their strengths in chip
design and manufacturing to jointly create flagship SoCs with high
performance and low power features, empowering global end
devices.

"We are committed to our vision of using the world's most
advanced technology to create cutting edge products that improve
our lives in meaningful ways," said Joe
Chen, President of MediaTek. "TSMC's consistent and
high-quality manufacturing capabilities enable MediaTek to fully
demonstrate its superior design in flagship chipsets, offering the
highest performance and quality solutions to our global customers
and enhancing the user experience in the flagship market."
"This collaboration between MediaTek and TSMC on MediaTek's
Dimensity SoC means the power of the industry's most advanced
semiconductor process technology can be as accessible as the
smartphone in your pocket," said Dr. Cliff
Hou, Senior Vice President of Europe and Asia
Sales at TSMC. "Throughout the years, we have worked closely
with MediaTek to bring numerous significant innovations to the
market and are honored to continue our partnership into the 3nm
generation and beyond."
TSMC's 3nm process technology provides enhanced performance,
power, and yield, in addition to complete platform support for both
high performance computing and mobile applications. Compared with
TSMC's N5 process, TSMC's 3nm technology currently offers as much
as 18% speed improvement at same power, or 32% power reduction at
same speed, and approximately 60% increase in logic density.
MediaTek's Dimensity SoCs, built with industry-leading process
technology, are designed to meet the ever-increasing user
experience requirements for mobile computing, high-speed
connectivity, artificial intelligence, and multimedia. MediaTek's
first flagship chipset using TSMC's 3nm process is expected to
empower smartphones, tablets, intelligent cars and various other
devices starting in the second half of 2024.
###
About MediaTek Inc.
MediaTek Incorporated (TWSE: 2454) is a global fabless
semiconductor company that enables nearly 2 billion connected
devices a year. We are a market leader in developing innovative
systems-on-chip (SoC) for mobile, home entertainment, connectivity
and IoT products. Our dedication to innovation has positioned us as
a driving market force in several key technology areas, including
highly power-efficient mobile technologies, automotive solutions
and a broad range of advanced multimedia products such as
smartphones, tablets, digital televisions, 5G, Voice Assistant
Devices (VAD) and wearables. MediaTek empowers and inspires people
to expand their horizons and achieve their goals through smart
technology, more easily and efficiently than ever before. We work
with the brands you love to make great technology accessible to
everyone, and it drives everything we do. Visit www.mediatek.com
for more information.
About TSMC
TSMC pioneered the pure-play foundry business model when it was
founded in 1987, and has been the world's leading dedicated
semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry's
leading process technologies and portfolio of design enablement
solutions to unleash innovation for the global semiconductor
industry. With global operations spanning Asia, Europe, and North
America, TSMC serves as a committed corporate citizen around
the world.
TSMC deployed 288 distinct process technologies, and
manufactured 12,698 products for 532 customers in 2022 by providing
broadest range of advanced, specialty and advanced packaging
technology services. The Company is headquartered in Hsinchu,
Taiwan. For more information
please visit https://www.tsmc.com.
MediaTek Press Office:
PR@mediatek.com
Kevin Keating, MediaTek
+1- 206-321-7295
10188 Telesis Ct #500, San Diego,
CA 92121, USA
TSMC Media
Contacts:
Nina Kao
Head of Public
Relations
Tel: 886-3-563-6688
ext.7125036
Mobile:
886-988-239-163
E-Mail:
nina_kao@tsmc.com
|
Michael
Kramer
Public
Relations
Tel: 886-3-563-6688
ext. 7125031
Mobile:
886-988-931-352
E-Mail:
pdkramer@tsmc.com
|
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