Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem
23 Agosto 2021 - 7:00AM
Business Wire
Intel Foundry Services will lead the first
phase of the U.S. Department of Defense’s RAMP-C program to
establish a domestic commercial foundry infrastructure.
What’s New: The U.S. Department of Defense, through the
NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement
to provide commercial foundry services in the first phase of its
multi-phase Rapid Assured Microelectronics Prototypes - Commercial
(RAMP-C) program. The RAMP-C program was created to facilitate the
use of a U.S.-based commercial semiconductor foundry ecosystem to
fabricate the assured leading-edge custom and integrated circuits
and commercial products required for critical Department of Defense
systems. Intel Foundry Services, Intel’s dedicated foundry business
launched this year, will lead the work.
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Intel’s newest factory, Fab 42, became
fully operational in 2020 on the company’s Ocotillo campus in
Chandler, Arizona. Fab 42 produces microprocessors using the
company’s 10nm manufacturing processes. In March 2021, Intel
announced a $20 billion investment to build out two new factories
(or “fabs”) on the Ocotillo campus. The company expects to begin
planning and construction activities this year. (Credit: Intel
Corporation)
“One of the most profound lessons of the past
year is the strategic importance of semiconductors, and the value
to the United States of having a strong domestic semiconductor
industry. Intel is the sole American company both designing and
manufacturing logic semiconductors at the leading edge of
technology. When we launched Intel Foundry Services earlier this
year, we were excited to have the opportunity to make our
capabilities available to a wider range of partners, including in
the U.S. government, and it is great to see that potential being
fulfilled through programs like RAMP-C.” – Pat Gelsinger, Intel
CEO
How It Works: Intel Foundry Services will partner with
industry leaders, including IBM, Cadence, Synopsys and others, to
support the U.S. government’s needs for designing and manufacturing
assured integrated circuits by establishing and demonstrating a
semiconductor IP ecosystem to develop and fabricate test chips on
Intel 18A, Intel’s most advanced process technology.
“The RAMP-C program will enable both commercial foundry
customers and the Department of Defense to take advantage of
Intel’s significant investments in leading-edge process
technologies,” said Randhir Thakur, Intel Foundry Services
president. “Along with our customers and ecosystem partners,
including IBM, Cadence, Synopsys and others, we will help bolster
the domestic semiconductor supply chain and ensure the United
States maintains leadership in both R&D and advanced
manufacturing. We look forward to a long-term collaboration with
the U.S. government as we deliver RAMP-C program milestones.”
Intel recently announced plans to become a major provider of
U.S.-based capacity for foundry customers, including an investment
of approximately $20 billion to build two new factories in Arizona.
These fabs will provide committed capacity for foundry customers
and support expanding requirements for Intel products.
Why It’s Important: The U.S. Department of Defense (DOD)
has recently sought to diversify its approach to securing advanced
microprocessors by leveraging commercially available technologies
developed by U.S. companies. Other than Intel, the majority of
U.S.-based chip designers are fabless, which means they design and
sell integrated circuits that are fabricated by contract
manufacturers called foundries. Today, more than 80 percent of
leading-edge manufacturing capacity is concentrated in Asia1,
leaving the DOD with limited onshore access to foundry technology
capable of meeting the country’s long-term needs for secure
microelectronics. The RAMP-C program was created to facilitate the
use of a commercially viable onshore foundry ecosystem that will
ensure DOD access to leading-edge technology, while allowing the
defense industrial base to leverage the benefits of high-volume
semiconductor manufacturing and design infrastructure of commercial
partners like Intel.
About the Broader Efforts: The RAMP-C program is part of
a larger initiative to strengthen government supply chain security
and accelerate U.S. leadership across the full spectrum of
integrated circuit design, manufacturing and packaging. In October
2020, DOD launched the RAMP program using the Advanced Commercial
Capabilities Project Phase 1 Other Transaction Authority. RAMP
advances and demonstrates commercial leading-edge physical
“back-end” assured design methods that transform a high-level chip
design into the complex, technology-specific polygon form that is
required as input for the wafer fabrication process. Intel is a
participant in this project.
Last year, DOD also awarded Intel the second phase of its
State-of-the-Art Heterogeneous Integration Prototype (SHIP)
program. The SHIP program enables the U.S. government to access
Intel’s U.S. advanced semiconductor packaging capabilities with the
goal of developing new approaches toward measurably secure,
heterogeneous integration and test of advanced packaging solutions.
SHIP will develop the capability to use advanced commercial
technology to package and test the integrated circuits designed in
RAMP and fabricated through RAMP-C.
More Context: Manufacturing at Intel News | Intel Wins US
Government Advanced Packaging Project | Intel Foundry Services Fact
Sheet
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
1 SEMI World Fab Forecast, December 2020.
Statements in this document that refer to future plans or
expectations, including with respect to the RAMP-C program and its
anticipated benefits, are forward-looking statements. These
statements are based on current expectations and involve many risks
and uncertainties that could cause actual results to differ
materially from those expressed or implied in such statements. For
more information on the factors that could cause actual results to
differ materially, see Intel’s most recent earnings release and SEC
filings at intc.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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Jason Gorss 1-518-698-7765 jason.gorss@intel.com
Intel (NASDAQ:INTC)
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