Intel introduces 13th Gen Intel Core
processors, expanded Intel Developer Cloud, Intel Geti computer
vision platform and more choice in graphics to kick off two-day
Intel Innovation event.
- The Intel Developer Cloud will make new and future hardware
platforms available for pre-launch development and testing, such as
the 4th Gen Intel® Xeon® Scalable processors (Sapphire Rapids) and
Intel® Data Center GPUs.
- Intel revealed major milestones across its line of data center
GPUs, in addition to pricing and availability for the first Intel®
Arc™ GPUs for gaming.
- The newly introduced 13th Gen Intel® Core™ processors offer the
world’s best gaming experience1 and stellar content creator
- The new Intel® Geti™ platform enables enterprises to quickly
and easily develop and deploy computer vision AI.
- To bring forth a new era of semiconductor innovation, Intel
will serve as a systems foundry, combining wafer manufacturing,
packaging, software and the chiplet ecosystem.
- Intel previewed future high-volume system-in-package
capabilities that will enable pluggable co-package photonics for a
variety of applications.
At its second annual Intel Innovation event
today, hardware and software developers gathered to hear Intel’s
latest advancements toward an ecosystem built on the tenets of
openness, choice and trust — from driving open standards to make
“systems of chips” possible at the silicon level, to enabling
efficient and portable multi-architecture artificial
This press release features multimedia. View
the full release here:
Intel’s second annual Intel Innovation
event begins Tuesday, Sept. 27, 2022, in San Jose, California.
Hardware and software developers will gather at the two-day event
to learn about Intel’s latest advancements toward an ecosystem
built on the tenets of openness, choice and trust. (Credit: Intel
Intel also showcased an array of new hardware, software and
services aimed at helping its broad ecosystem of developers
overcome challenges and deliver new generations of innovation.
More: Intel Innovation 2022 (Press Kit) | Intel
Innovation Day 1 Broadcast (Livestream/Replay) | The Future is Wide
Open (Greg Lavender Editorial) | Intel Innovation Day 1 Live Blog |
Intel Launches 13th Gen Intel Core Processor Family Alongside New
Intel Unison Solution (News) | 13th Gen Intel Core Processors
“In the next decade, we will see the continued digitization of
everything. Five foundational technology superpowers — compute,
connectivity, infrastructure, AI and sensing — will profoundly
shape how we experience the world,” said Intel CEO Pat Gelsinger.
“Developers, both software and hardware focused, will build this
future. They are the true magicians that advance what’s possible.
Fostering this open ecosystem is at the center of our
transformation and the developer community is essential to our
Boosting Developer Productivity with Early Hardware,
In his keynote to open the event, Gelsinger presented a number
of challenges that developers face — vendor lock-in, access to the
latest hardware, productivity and time-to-market, and security, to
name a few — and introduced a multitude of solutions to help
overcome them, including:
- New and forthcoming technologies a click away in the Intel
Developer Cloud: Starting in a limited beta trial, the Intel
Developer Cloud has expanded to give developers and partners early
and efficient access to Intel technologies — from a few months up
to a full year ahead of product availability. During beta, selected
customers and developers can try out and test many of Intel’s
latest platforms in the coming weeks, including 4th Gen Intel®
Xeon® Scalable processors (Sapphire Rapids), 4th Gen Intel® Xeon®
processors with high bandwidth memory (HBM), Intel® Xeon® D
processors, Habana® Gaudi®2 deep learning accelerators, Intel® Data
Center GPU (code-named Ponte Vecchio) and Intel® Data Center GPU
- Computer vision AI, built faster and easier: The new and
collaborative Intel® Geti™ computer vision platform (formerly
Sonoma Creek) enables anyone in the enterprise — from data
scientists to domain experts — to quickly and easily develop
effective AI models. Through a single interface for data upload,
annotation, model training and retraining, Intel Geti reduces the
time, AI expertise and cost needed to develop models. With built-in
optimizations for OpenVINO, teams can deploy high-quality computer
vision AI within their enterprises to drive innovation, automation
The Intel Developer Cloud, together with developer tools and
resources designed to optimize performance including Intel® oneAPI
toolkits and the Intel Geti platform, can help accelerate time to
market for solutions built on Intel platforms.
Expanded Technology Portfolio Offers Flexibility and
Gelsinger also used the occasion to present the latest advances
across Intel’s product portfolio, including:
- A new standard for desktop processor performance:
13th Gen Intel Core desktop processors, led by the flagship Intel®
Core™ i9-13900K, help users better game, create and work with up to
15% better single-threaded performance and up to 41% better
multi-threaded performance gen-over-gen.
- A big step for Intel GPUs: Gelsinger provided updates
across Intel’s graphics products, a key area of growth for Intel.
Server blades with the Intel Data Center GPU, code-named Ponte
Vecchio, are now shipping to Argonne National Laboratory to power
the Aurora supercomputer.
- New workloads for Flex Series GPUs: The Intel Data
Center GPU Flex Series, announced in August, gives customers a
single GPU solution for a wide range of visual cloud workloads. It
will now run popular industry AI and deep learning frameworks,
including OpenVINO, TensorFlow and PyTorch. AI neuroscience
customer Numenta, working in collaboration with Stanford University
on real-world inference workloads on MRI data using Intel’s Flex
Series GPU, is reporting amazing performance results.
- Intel Arc GPUs for gamers: Intel is committed to
bringing back price and performance balance for gamers with the
Intel Arc graphics family. The Intel® Arc™ A770 GPU will be
available in a variety of designs at retail starting at $329 on
Oct. 12, providing compelling content creation and 1440p gaming
- A high-fidelity AI boost for games: XeSS, or Xe Super
Sampling, a gaming performance accelerator that works across Intel
discrete and integrated graphics, is now rolling out to existing
games through updates and will be available in more than 20 titles
this year. The XeSS software developer kit is also now available on
- Many devices, one experience: Intel® Unison™ is a new
software solution that provides seamless connectivity between
phones (Android and iOS) and PCs — starting with functionality
including file transfer, text messaging, phone calls and phone
notifications — coming to new laptops starting later this
- Data center acceleration, on demand: 4th Gen Intel Xeon
Scalable processors include a number of accelerators for AI,
analytics, networking, storage and other demanding workloads.
Through the new Intel® On Demand activation model, customers can
turn on additional accelerators, beyond the base configuration of
the original SKU, for greater flexibility and choice when
Systems Foundry Opens ‘New Era for Chipmaking’
Leaders from Samsung and TSMC joined Gelsinger in his keynote to
voice support for the Universal Chiplet Interconnect Express (UCIe)
consortium, which aims to create an open ecosystem for enabling
chiplets designed and manufactured on different process
technologies by different vendors to work together when integrated
with advanced packaging technologies. With the three largest
chipmakers and more than 80 of the leading companies in the
semiconductor industry joining UCIe, “we are now making it a
reality,” Gelsinger said.
To lead this platform transformation enabling new customer and
partner solutions with chiplets, Gelsinger explained that “Intel
and Intel Foundry Services will usher in the era of the systems
foundry,” with four major components: wafer manufacturing,
packaging, software and an open chiplet ecosystem. “Innovation once
thought impossible has opened entirely new possibilities for
chipmaking,” Gelsinger said.
Intel previewed another such innovation in development: a
breakthrough pluggable co-package photonics solution. Optical
connections hold promise to enable new levels of chip-to-chip
bandwidth, particularly in the data center, but manufacturing
difficulties make them untenably expensive. To overcome this, Intel
researchers devised a robust, high-yielding, glass-based solution
with a pluggable connector that simplifies manufacturing and lowers
costs, opening possibilities for new system and chip package
architectures in the future.
Building the future requires software, tools and products, and
it also requires funding. Early this year, Intel launched the $1
billion IFS Innovation Fund to support early-stage startups and
established companies building disruptive technologies for the
foundry ecosystem. Today, the company announced the first round of
companies that have received funding, a diverse group innovating
across the entire semiconductor stack. The first round
- Astera, a leader in purpose-built data and memory connectivity
solutions to remove performance bottlenecks throughout the data
- Movellus, which helps improve system-on-chip performance and
power consumption, and simplifies timing closure with a unique
platform that solves clock distribution challenges.
- SiFive, developing high-performance cores based on the
open-source RISC-V instruction set architecture.
This is just the beginning of the news from Intel Innovation.
Tune in at 8:30 a.m. PDT Wednesday to hear from Intel Chief
Technology Officer Greg Lavender on how ubiquitous computing is
creating endless opportunities for innovating at the speed of
software and what Intel is doing to help developers unleash their
potential. He’ll show more peeks into the future, and share the
stage with a surprise guest, too.
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
1 World’s Best Gaming Experience based on performance and unique
features of 13th Gen Intel® Core™ processors, including in
comparison to 12th Gen Intel Core i9-12900K, AMD Ryzen 9 5950X, and
AMD Ryzen 7 5800X3D, as of Sept. 7, 2022. See
www.intel.com/PerformanceIndex for details.
Intel® Unison™ solution is currently only available on eligible
Intel® Evo™ designs on Windows-based PCs and only pairs with
Android- or iOS-based phones; all devices must run a supported OS
version. See intel.com/performance-evo for details, including setup
requirements. Results may vary.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
version on businesswire.com: https://www.businesswire.com/news/home/20220927005457/en/
Danielle Mann 1-973-997-1154 firstname.lastname@example.org
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