DALLAS, Dec. 14,
2022 /PRNewswire/ -- Texas Instruments (TI)
(NASDAQ: TXN), a leader in high-voltage semiconductor solutions,
today announced that Chicony Power designed in TI's integrated
gallium nitride (GaN) technology to power its latest 65-W laptop
power adapter, Le Petit. Leveraging TI's half-bridge GaN FET with
integrated gate driver, LMG2610, Chicony Power and TI
collaborated on a design to reduce the size of Chicony's power
adapter by 50% and increase efficiency up to 94%.
As a leading power supply provider committed to improving power
conversion efficiency in electronic power designs, Chicony Power
has worked closely with international IC companies, providing them
with market and technical requirements to help develop solutions in
new designs. For the Le Petit laptop adapter design, Chicony Power
teamed up with TI for its expertise in high-voltage design and its
integrated GaN technology. TI's LMG2610 is designed to be paired
with the UCC28782 active clamp flyback (ACF) controller to create
an easy-to-use, high-efficiency, and high-power-density solution
for AC/DC designs under 75 W.
Improving power conversion efficiency
Increasingly,
consumers seek smaller, lighter electronics while also wanting to
reduce their energy footprint. In the laptop power adapter market,
this has challenged engineers to find new ways to pack more power
in smaller spaces while minimizing power loss to deliver more
efficient adapters.
Chicony Power and TI were able to miniaturize the power adapter
design and lower the use of mechanical materials by 40% by
leveraging TI's LMG2610 GaN FET, which integrates upper and lower
switches, gate driver IC, level shifter and bootstrap circuits on a
single chip, as well as Chicony Power's 3D structure, component
miniaturization, heat dissipation system and electromagnetic
interference (EMI) suppression design expertise. Le Petit has a
compact size of 49 cm3, slightly larger than a typical ice cube,
with a power supply conversion efficiency as high as 94% compared
to the 89% efficiency achieved by typical power adapters using
silicon materials.
"Our collaboration with Chicony Power is an example of how TI's
products help make electronics smaller, more energy-efficient and
more reliable," said Luke Lee, TI's
vice president for Asia and
president for Taiwan, Korea and
South Asia. "Our highly integrated
GaN technology enables power adapters with improved thermal
performance and power efficiency while delivering high power
density with fewer components."
"Chicony has been committed to corporate social responsibility
and has been implementing the code of conduct of Responsible
Business Alliance (RBA) for many years," said Winson Huang, chief procurement officer, Chicony
Power. "The collaboration with TI to develop a new generation
of power adapters will not only provide consumers with lighter and
more convenient devices, compared to other 65-W adapters in the
market, but also use the advantages of both parties to jointly
create more energy-efficient products."
Addressing thermal and EMI challenges
In addition to
power efficiency and size advantages delivered by TI's integrated
GaN technology, the UCC28780 and UCC28782 flyback controllers
support high-frequency zero-voltage switching (ZVS) design.
Combining these advantages with Chicony Power's power design
expertise, Chicony Power's designers were able to overcome the
temperature increases and rise in EMI typically caused by higher
frequency energy in lightweight power supplies, and effectively
reduced the size of the power adapter while maintaining temperature
and performance control.
To learn more about Chicony Power, see
https://www.chiconypower.com.
For more information on TI's GaN technology,
see ti.com/gantechnology.
About Texas Instruments
Texas Instruments Incorporated
(Nasdaq: TXN) is a global semiconductor company that designs,
manufactures, tests and sells analog and embedded processing chips
for markets such as industrial, automotive, personal electronics,
communications equipment and enterprise systems. Our passion to
create a better world by making electronics more affordable through
semiconductors is alive today, as each generation of innovation
builds upon the last to make our technology smaller, more
efficient, more reliable and more affordable – making it possible
for semiconductors to go into electronics everywhere. We think of
this as Engineering Progress. It's what we do and have been doing
for decades. Learn more at TI.com.
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SOURCE Texas Instruments