DALLAS, Jan. 17,
2023 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq:
TXN) today introduced the first purpose-built semiconductors with
ultrasonic lens cleaning (ULC) technology, enabling camera systems
to quickly detect and remove dirt, ice and water using microscopic
vibrations.
Removing contaminants from camera lenses traditionally requires
manual cleaning, causing system downtime, or the use of various
mechanical parts that could malfunction. TI's new ULC chipset,
including the ULC1001 digital signal processor (DSP) and companion
DRV2901 piezo transducer driver, features a proprietary technology
that allows cameras to rapidly self-clear contaminants using
precisely controlled vibrations to rapidly eliminate debris, which
improves system accuracy and reduces maintenance requirements. The
chipset offers designers a compact and affordable way to use ULC in
a wide range of applications and camera sizes. For more
information, see www.ti.com/ulc1001-pr and
www.ti.com/drv2901-pr.
"ULC can make widespread use of self-cleaning cameras and
sensors a reality. Existing cleaning approaches are expensive and
impractical, requiring complicated mechanics, costly electronics
and significant processing to detect contaminants and execute
cleaning," said Avi Yashar, product
marketing engineer at TI. "With the recent proliferation of cameras
in a variety of applications, from automotive and traffic cameras
to smart cities and manufacturing, there's a strong need for a
simple, cost-effective way to enable self-cleaning cameras."
The ULC1001 controller includes proprietary algorithms for
automatic sensing, cleaning, and temperature and fault detection
without any image processing, making ULC technology highly
adaptable to various camera lens designs. The chipset's small
form factor makes it possible to improve machine vision and sensing
in a variety of applications – any place that a camera or sensor
could get dirty. To learn how it works, read the technical article,
"Ultrasonic Lens Cleaning: A Solid-State Technology You Didn't Know
You Needed."
"As advanced driver assistance systems [ADAS] become more
sophisticated and drivers rely on them more extensively, it will
become more important than ever that the sensor suite is fully
operational at all times," said Edward
Sanchez, senior analyst, global automotive practice,
TechInsights. "Dirt or foreign material on a camera lens, which
would be just a nuisance in the case of a rearview camera, becomes
a vital functional and safety issue on a vehicle that relies on
accurate and precise imaging and sensor data. TI's ULC approach
addresses what will soon be a significant issue in the ADAS and
autonomous vehicle market both practically and
cost-effectively."
Reduce system size and complexity with an integrated
solution
TI's ULC chipset eliminates the need for complex mechanical
parts and human intervention in lens cleaning systems. The ULC1001
ultrasonic cleaning DSP with proprietary algorithms integrates a
pulse-width modulator, current- and voltage-sense amplifiers and an
analog-to-digital converter. Used together with the DRV2901 piezo
transducer driver as a companion amplifier, TI's chipset enables
ULC in a compact footprint with a printed circuit board size less
than 25 mm by 15 mm, reducing the bill of materials while providing
more functionality than a discrete implementation.
Package, availability and pricing
The ULC1001 DSP is in volume production and available for
purchase on TI.com and authorized distributors in a 4.5-mm-by-5-mm,
32-pin HotRod™ quad flat no-lead (QFN) package, with pricing at
US$6.43 in 1,000-unit quantities. The
DRV2901 piezo transducer driver is available for purchase for
US$5.35 in 1,000-unit quantities.
Full reels are available on TI.com and through other channels. The
evaluation module, ULC1001-DRV290XEVM, can be requested on
TI.com for US$249. Multiple payment
and shipping options are available on TI.com.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global
semiconductor company that designs, manufactures, tests and sells
analog and embedded processing chips for markets such as
industrial, automotive, personal electronics, communications
equipment and enterprise systems. Our passion to create a better
world by making electronics more affordable through semiconductors
is alive today, as each generation of innovation builds upon the
last to make our technology smaller, more efficient, more reliable
and more affordable – making it possible for semiconductors to
go into electronics everywhere. We think of this as Engineering
Progress. It's what we do and have been doing for decades. Learn
more at TI.com.
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SOURCE Texas Instruments