SiXG301 and SiXG302, Silicon Labs' first
wireless SoC families at the 22 nm process node, deliver
breakthroughs in compute, power efficiency, integration and
security
AUSTIN,
Texas, May 22, 2025 /PRNewswire/ -- Silicon Labs,
the leading innovator in low-power wireless solutions, today
announced the first products of its Series 3 portfolio with the
introduction of two new wireless SoC families built at the advanced
22 nanometer (nm) process node: the SiXG301 and SiXG302. These
highly integrated solutions represent a significant leap forward in
compute power, integration, security, and energy efficiency,
addressing the growing demands of both line-powered and
battery-powered IoT devices.
As smart devices grow more sophisticated and compact, the need
for powerful, secure, and highly integrated wireless solutions has
never been greater. The new Series 3 SoCs deliver on this promise
with advanced processing capabilities, flexible memory options,
best-in-class security, and streamlined external component
integration. Silicon Labs' Series 1, Series 2, and Series 3
platforms will continue to complement one another in the market and
address the full breadth of IoT applications.
The new Series 3 families of SoCs include:
- SiXG301: Optimized for Line-Powered Applications
Purpose-built for line-powered smart devices, the SiXG301 includes
an integrated LED pre-driver and offers an ideal solution for
advanced LED smart lighting and smart home products, supporting
Bluetooth, Zigbee, and Thread with support for Matter. Built with
high Flash and RAM overhead of 4 MB and 512 kB, respectively, the
SiXG301 helps future-proof customer designs as the requirements for
Matter and other more demanding IoT applications continue to grow.
This SoC enables concurrent multi-protocol operation for Zigbee,
Bluetooth and Matter over Thread networks at the same time, which
helps simplify manufacturing SKUs, reduce costs, save board space
for additional device integrations, and improve consumer usability.
Already in production with select customers, the SiXG301 is slated
for general availability in Q3 2025.
- SiXG302: Designed for Battery-Powered Efficiency
Expanding Series 3 to battery-powered applications, the upcoming
SiXG302 will deliver groundbreaking energy efficiency without
sacrificing performance. Featuring Silicon Labs' advanced power
architecture, the SiXG302 is designed to use only 15 µA/MHz active
current, 30% lower than competitive devices in its class. This
makes it ideal for battery-powered wireless sensors and actuators
for both Matter and Bluetooth applications. The SiXG302 is planned
for customer sampling in 2026.
"Smart devices are becoming more complex, and designers are
challenged to pack greater functionality into smaller spaces while
maintaining energy efficiency," said Ross
Sabolcik, Senior Vice President of Product Lines at Silicon
Labs. "With the SiXG301 and upcoming SiXG302 families, we're
delivering flexible, highly integrated solutions that enable
next-generation IoT devices—whether they're plugged in or running
on battery power."
The SiXG301 and SiXG302 families will initially include "M"
devices for multiprotocol, the SiMG301 and SiMG302, and "B" devices
optimized for Bluetooth LE communications, the SiBG301 and
SiBG302.
By leveraging the 22 nm process node for all Series 3 devices,
Silicon Labs is addressing the growing demand for more powerful and
efficient far-edge devices across a wide range of IoT
applications—from smart cities and industrial automation to
healthcare, smart homes, and beyond. These new SoCs offer device
makers a scalable, secure platform to create the next wave of
innovative, high-performance IoT products.
Learn More About the Series 3 Platform at Works With
2025
To learn more about the Series 3 platform and how it is
advancing wireless connectivity, visit:
- Learn more about Series 3 Wireless Platform
- Learn more about SiMG301
- Learn more about SiBG301
Additionally, Silicon Labs will highlight the SiXG301 along with
its portfolio of industry-leading innovations during the 2025 Works
With conference series. This global event brings together industry
experts to explore the best practices, emerging technologies, and
transformative trends shaping the industry. The conference will be
hosted across multiple international locations, with a virtual
edition available for broader accessibility:
- Works With Summit: October 1-2 in
Austin, TX
- Works With Shenzhen: October
23
- Works With Bangalore: October
30
- Works With Virtual: November
19-20
Learn more about Works With today.
About Silicon Labs Silicon Labs (NASDAQ: SLAB) is the
leading innovator in low-power wireless connectivity, building
embedded technology that connects devices and improves lives.
Merging cutting-edge technology into the world's most highly
integrated SoCs, Silicon Labs provides device makers with the
solutions, support, and ecosystems needed to create advanced edge
connectivity applications. Headquartered in Austin,
Texas, Silicon Labs has operations
in over 16 countries and is the trusted partner for innovative
solutions in the smart home, industrial IoT, and smart cities
markets. Learn more at www.silabs.com.
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SOURCE Silicon Labs