Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results
18 Outubro 2023 - 11:45AM
Business Wire
Highlights:
- AI-driven Cadence Cerebrus was utilized by multiple business
units at Broadcom on a multitude of cutting-edge complex product
designs at advanced nodes
- Broadcom’s product designs achieved impressive improvements in
performance, power, and area
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a
collaboration with Broadcom Inc. to implement new AI-driven design
flows to accelerate the delivery of their innovative 3nm and 5nm
designs. Using the AI-driven Cadence® Cerebrus™ Intelligent Chip
Explorer, many business units achieved impressive performance,
power and area (PPA) benefits. Given the complexity and size of
Broadcom’s product designs at advanced nodes, AI-driven technology
can be a game changer to achieve aggressive time to tapeout
schedules.
Due to the advanced capabilities of Cadence Cerebrus, Broadcom
has been able to automate tasks through AI, for improving final
design data and turnaround time. For example, the floorplan
exploration capability helps automatically determine the optimal
chip design floorplan, saving PPA. The AI model reuse capability
enables Broadcom to apply previous design learnings to their
next-generation designs, reducing the time to optimized results.
Finally, the easy-to-use interface provides interactive analytics,
offering valuable insights into design data and easy debug.
“We use a wide portfolio of Cadence solutions across our
business units, and we have seen outstanding PPA improvements from
the use of the AI capabilities of Cadence Cerebrus,” said Yuan Xing
Lee, Vice President and Head of Central Engineering, Broadcom.
“Over the last year, we have seen accelerated adoption of Cadence
Cerebrus AI technology across multiple business units within
Broadcom and we look forward to taking advantage of this technology
in our next generation of products. Cadence has been a key silicon
design partner for many years now, and we look forward to
continuing to work together to achieve our design goals and deliver
high-quality designs to customers.”
“With the AI-driven capabilities of Cadence Cerebrus, Broadcom
successfully reduced manual tasks so they could focus on
higher-impact, strategic work while meeting PPA goals,” said Dr.
Chin-Chi Teng, Senior Vice President and General Manager, Digital
& Signoff Group, Cadence. “Today’s designs are very complex,
and through our continued collaboration, we are working together to
ensure that Broadcom is able to utilize our AI capabilities to
deliver compelling designs to market faster.”
The Cadence Cerebrus Intelligent Chip Explorer is part of the
broader digital full flow, which provides optimal PPA and reduced
turnaround time. It supports Cadence’s Intelligent System Design™
strategy, providing system-on-chip (SoC) design excellence. For
more information on Cadence Cerebrus, visit
www.cadence.com/go/cerebrusbcmpr.
About Cadence
Cadence is a pivotal leader in electronic systems design,
building upon more than 30 years of computational software
expertise. The company applies its underlying Intelligent System
Design strategy to deliver software, hardware and IP that turn
design concepts into reality. Cadence customers are the world’s
most innovative companies, delivering extraordinary electronic
products from chips to boards to complete systems for the most
dynamic market applications, including hyperscale computing, 5G
communications, automotive, mobile, aerospace, consumer, industrial
and healthcare. Fortune magazine has named Cadence one of the 100
Best Companies to Work For for nine years in a row. Learn more at
cadence.com.
© 2023 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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For more information, please contact: Cadence Newsroom
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