Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference
24 Outubro 2023 - 11:45AM
Business Wire
AI enhancements and Tensilica Xtensa LX8
platform capabilities deliver significant performance improvements
with industry-best energy efficiency
Cadence Design Systems, Inc.(Nasdaq: CDNS) today expanded its
industry-leading Tensilica® HiFi and Vision DSP families with the
introduction of four new DSPs based on the recently announced
Tensilica Xtensa® LX8 processor platform. The new HiFi and Vision
DSPs address increasing system-level performance and AI
requirements for an expanded range of applications—delivering
enhanced performance across multiple algorithms with even greater
energy efficiency. The expanded portfolio includes the Cadence®
Tensilica HiFi 1s DSP and HiFi 5s DSP for audio/voice, lightweight
imaging and AI applications and the Tensilica Vision 110 DSP and
Vision 130 DSP for image sensor, camera, radar and lidar
applications.
“With lengthy SoC design cycles and rapidly changing AI
algorithms, our SoC customers require the utmost flexibility.
On-device and edge AI systems feature numerous diverse sensors, so
any AI inference solution must be adaptable to the end application
requirements,” said David Glasco, vice president of research and
development for Tensilica IP at Cadence. “Designing with a
system-level perspective is crucial, and these SoCs must be
energy-efficient, flexible and future proof to accommodate new
neural networks. Cadence continues to make significant investments
in our Tensilica product line, and our latest HiFi and Vision DSPs
reflect that commitment.”
Xtensa LX8 Platform and Common Benefits
The new HiFi and Vision DSPs benefit from the inherent
advantages of the Xtensa LX8 platform, including native AMBA® AXI
support for lower latency and L2 cache for increased system
performance. Branch prediction enables a 5% to 20% reduction in
cycles for both the HiFi and Vision DSPs. Supported by Cadence’s
new NeuroWeave™ Software Development Kit (SDK), the DSPs can be
paired with the Cadence Neo™ Neural Processing Units (NPUs) to
offload AI inference workloads.
HiFi 1s and HiFi 5s DSPs
The new Tensilica HiFi DSPs add more capabilities for
lightweight imaging and AI to meet market demands—enabling them to
serve as additional compute resources beyond just audio, either as
a standalone solution or complementing the Vision DSPs and Neo
NPUs. Individually and collectively, the following features
significantly improve out-of-box performance—dramatically reducing
time to market (TTM) for OEMs and software developers:
- Double-precision floating-point acceleration provides up to 30X
better out-of-box performance of popular codecs, enabling easier
handling for computation requiring expanded dynamic range and
precision
- Hardware/software co-design enhances auto-vectorization,
greatly reducing the need for hand-optimized code and providing
source code compatibility across HiFi DSPs
- New 8-bit operations in the HiFi 1s DSP boost imaging and AI
performance by up to 2X at the kernel level, compared to the HiFi 1
DSP
- L2 cache increases system performance by up to 50%
More details on the new HiFi DSPs can be found at
www.cadence.com/go/HiFi1s and www.cadence.com/go/HiFi5s.
Vision 110 and 130 DSPs
The 128-bit Tensilica Vision 110 DSP and 512-bit Vision 130 DSP
offer numerous performance improvements to address growing sensor
and AI workloads, offloading from the CPU or GPU while providing
industry-best energy efficiency. Both DSPs deliver AI performance
enhancements that enable up to 3X improvement for certain AI
workloads and up to 5X improvement on specific kernels. Additional
benefits include:
- Up to 20 percent higher frequency and up to 2X improvement for
16-bit, 32-bit and 64-bit floating-point performance
- Better system performance through iDMA enhancements previously
available only on the flagship high-performance Vision DSPs
- Up to 3X improvements in fast Fourier transform (FFT) for radar
applications
- Reduction in code memory footprint due to code size
improvement
- Common SIMD and VLIW architecture and instruction set with
Vision DSP predecessors ensure easy software migration
More details on the new Vision DSPs can be found at
www.cadence.com/go/Vision110 and www.cadence.com/go/Vision130.
Supporting Quotes:
“Hailo is developing powerful AI-centric vision processors
serving the growing edge AI market. ln our recently announced
Hailo-15 device targeting the IP camera market, we've chosen to
integrate Cadence’s Tensilica DSP among the computational
subsystems complementary to our proprietary neural engine,” said
Guy Kaminitz, VP VLSI at Hailo. “Cadence’s Tensilica DSPs offer the
performance and energy efficiency as well as the flexibility
required for such heterogeneous devices.”
“Kneron continues to develop market-leading SoCs for numerous
on-device and edge AI applications, and selecting an efficient
processor to complement our high-performance NPU is crucial,” said
Albert Liu, CEO of Kneron. “We continue to use Cadence Tensilica
Vision DSPs, which provide the computational throughput and
flexibility needed to keep up with today’s complex AI workload
requirements. Additionally, Tensilica's extensive framework of
software libraries and strong partner ecosystem enable rapid
deployment for fast time to market.”
Availability
Tensilica HiFi and Vision DSPs support Cadence’s Intelligent
System Design™ strategy, enabling SoC design excellence. The HiFi
3z DSP, HiFi 4 DSP, ConnX 110 DSP, ConnX 120 DSP, MathX 110 DSP and
MathX 130 DSP have also been upgraded to the Xtensa LX8
platform.
The Vision 110 DSP and Vision 130 DSP, as well as the upgraded
ConnX 110 DSP, ConnX 120 DSP, MathX 110 DSP and MathX 130 DSP, are
available now. The new HiFi DSPs are expected to be in general
availability in December 2023.
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For nine
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
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