Opening marks a milestone for high-volume
manufacturing of 3D advanced packaging technologies.
What’s New: Today, Intel celebrated the opening of Fab 9,
its cutting-edge factory in Rio Rancho, New Mexico. The milestone
is part of Intel's previously announced $3.5 billion investment to
equip its New Mexico operations for the manufacturing of advanced
semiconductor packaging technologies, including Intel’s
breakthrough 3D packaging technology, Foveros, which offers
flexible options for combining multiple chips that are optimized
for power, performance and cost.
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A drone photo shows Intel's new Fab 9 in
Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel's
previously announced $3.5 billion investment to equip its New
Mexico operations for the manufacturing of advanced semiconductor
packaging technologies. (Credit: Intel Corporation)
“Today, we celebrate the opening of Intel’s first high-volume
semiconductor operations and the only U.S. factory producing the
world’s most advanced packaging solutions at scale. This
cutting-edge technology sets Intel apart and gives our customers
real advantages in performance, form factor and flexibility in
design applications, all within a resilient supply chain.
Congratulations to the New Mexico team, the entire Intel family,
our suppliers, and contractor partners who collaborate and
relentlessly push the boundaries of packaging innovation.” – Keyvan
Esfarjani, Intel executive vice president and chief global
operations officer
Why It Matters: Intel’s global factory network is a
competitive advantage that enables product optimization, improved
economies of scale and supply chain resilience. The Fab 9 and Fab
11x facilities in Rio Rancho represent the first operational site
for mass production of Intel’s 3D advanced packaging technology. It
is also Intel's first co-located high-volume advanced packaging
site, marking an end-to-end manufacturing process that creates a
more efficient supply chain from demand to final product.
Fab 9 will help fuel the next era of Intel’s innovation in
advanced packaging technologies. As the semiconductor industry
moves into the heterogeneous era that uses multiple “chiplets” in a
package, advanced packaging technologies, such as Foveros and EMIB
(embedded multi-die interconnect bridge), offer a faster and more
cost-efficient path toward achieving 1 trillion transistors on a
chip and extending Moore’s Law beyond 2030.
Foveros, Intel’s 3D advanced packaging technology, is a
first-of-its-kind solution that enables the building of processors
with compute tiles stacked vertically, rather than side-by-side. It
also allows Intel and foundry customers to mix and match compute
tiles to optimize cost and power efficiency.
"This investment by Intel underscores New Mexico’s continued
dedication to bring manufacturing back home to America," said Gov.
Michelle Lujan Grisham. "Intel continues to play a key role in the
state’s technology landscape and strengthen our workforce,
supporting thousands of New Mexico families.”
The $3.5 billion investment in Rio Rancho has created hundreds
of high-tech Intel jobs, more than 3,000 construction jobs and an
additional 3,500 jobs across the state.
About Intel’s Commitment to Corporate Responsibility:
Intel remains committed to minimizing its environmental footprint
as it expands its operations to support the growing demand for
semiconductors. Fab 9 is on track to meet its goal to recycle at
least 90% of construction waste, exceeding the goal most recently
in November and December 2023.
Intel also purchases renewable electricity to meet 100% of its
New Mexico electricity use. The company has also funded three
nonprofit-led water restoration projects benefiting New Mexico
watersheds that are estimated to restore more than 100 million
gallons of water annually. These projects helped Intel return and
restored more than 100% of its New Mexico freshwater to the
community and local watersheds in 2022. It also conserved more than
500 million gallons of water at its New Mexico site, the equivalent
annual water use of more than 4,500 U.S. homes1.
About Intel New Mexico: Intel’s presence in Rio Rancho
dates to 1980, with a cumulative investment of more than $16
billion in capital. Intel's commitment goes beyond business
operations; it extends into the community. Over the past five
years, Intel employees volunteered more than 65,000 hours in New
Mexico. Additionally, Intel, the Intel Foundation and Intel
employees have donated more than $6.5 million to support local
nonprofits and schools since 2018.
Intel actively engages with the Rio Rancho community through
volunteering, collaborations with nonprofits and investments in
education. For example, Intel has helped establish endowment
scholarships among five New Mexico colleges and universities. These
endowments build on Intel’s ongoing work to support workforce
development and education in New Mexico, including internship
programs, local associate degree programs, investments in STEAM
education and others.
More Context: Paving Inclusive Pathways to the Technology
Industry in New Mexico (Fact Sheet) | Building a Sustainable Future
in New Mexico (Fact Sheet) | Intel Opens Fab 9 in Rio Rancho, New
Mexico (Quote Sheet) | Intel Advanced Packaging in New Mexico’s Fab
9, Manufacturing in Fab 11X (B-Roll Video) | Fab 9: High-Volume
Manufacturing of 3D Advanced Packaging Technologies in New Mexico
(YouTube Video)
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
1 https://www.epa.gov/watersense/how-we-use-water
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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version on businesswire.com: https://www.businesswire.com/news/home/20240124070327/en/
Kiana Cacchione 1-602-989-0640 kiana.cacchione@intel.com
Intel (NASDAQ:INTC)
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