Ralink Chooses Diamond 40RF ATE Platform From Credence for New WLAN Chipset Solution
09 Junho 2008 - 5:15PM
Marketwired
MILPITAS, CA , a provider of test solutions for the worldwide
consumer semiconductor industry, announced today that Ralink (TSE:
3534), one of the world's leading manufacturers of WLAN chipsets
used for Wi-Fi, mobile and embedded applications, has selected the
Diamond(TM) 40RF platform from Credence to test its 802.11n
single-chip solutions for Wi-Fi communications.
Ralink has selected the Diamond 40RF (D40 RF) for production
testing of its newest devices, the RT3070, the industry's smallest
802.11n USB single chip as client devices and other 11n single-chip
solutions. The RT3070 is highly integrated and cost-effective for
small form factor and low power applications. In an 8mm x 8mm QFN
package, this chip solution benefits from the capability of the D40
RF to meet requirements for RF and digital testing as well as
massive multi-site testing. Ralink will also utilize the versatile
D40 RF to test monolithically integrated RF transmitters,
receivers, systems on chip (SoC), and 10/100Mbps Ethernet physical
layer interfaces. Additionally, Ralink expects to drive numerous
Diamond 40RF systems with their outsource assembly and test (OSAT)
partners in Taiwan, benefiting from the platform's ability to
deliver tremendous throughput with a high degree of parallelism for
production efficiency and lowest overall cost of production
test.
"We chose the D40 RF because of its qualified capability to test
our 802.11n SoC. Its ability to test RF, mixed signal and digital
in a single platform is ideal," said Dr. Dennis Lo, Senior Vice
President of Ralink Technology. "The current RF and digital SoC
solutions on Credence's platform were qualified and proven to meet
our production requirements. The D40 RF is highly cost-effective,
critical to our bottom-line operations as we seek to deliver the
performance, interoperability, ease of use and security demanded by
our business and consumer-based customers."
The Diamond 40RF test system combines analog, digital, mixed
signal, and RF test instrumentation to support a wide range of
consumer IC device test. Incorporating Credence's patented MVNA(TM)
(Modulated Vector Network Analysis) technology, the D40 RF adds
wireless test capabilities for mobile phone, WLAN, WiMAX and ZigBee
devices. Offering from 10 to up to 40 slots, the D40 RF supports
over 3000 pins for very large ASIC testing, or massive multi-site
test requirements ( > 16 sites) in a modular system architecture
that allows the tester infrastructure to grow as the number of
sites expands, maintaining test economics. The D40 RF can expand in
10 slot increments ensuring a match of system capability to various
test requirements.
Amir Aghdaei, Senior Vice President of Field Operations and
Marketing for Credence, said, "We have a long collaborative
partnership with Ralink and are delighted to continue to expand our
relationship at this exciting time in their growth as a public
company. As they seek to grow their market share in the retail and
PC markets, and aggressively deploy into handheld multimedia
applications, handsets and other consumer electronics segments, we
have the ability to meet their demand with our versatile Diamond
platforms. We look forward to our mutual success as we assist them
in achieving their targeted goals."
About Credence
Credence Systems Corporation is a global provider of automated
test equipment (ATE) solutions to the high growth, consumer
semiconductor industry. Credence is committed to deliver the
highest standards of value -- an optimal combination of technology,
turn-around time, reliability, ease of use, service and support --
to every customer, which enables important cost and performance
advantages for integrated device manufacturers (IDMs), wafer
foundries, outsource assembly and test (OSAT) suppliers and fabless
chip companies worldwide. An ISO 9001-certified company with a
presence in 20 countries, Credence is headquartered in Milpitas,
California. More information is available at
http://www.credence.com.
About Ralink
Ralink Technology Corporation is a leading innovator and
developer of wireless LAN chipset solutions. Ralink 802.11x
chipsets are recognized for superior throughput, extended range,
low-power consumption and consistent reliability demanded by Wi-Fi,
mobile and embedded applications. These feature-rich chipsets have
a high level of chip integration for client and AP solutions for
CB, miniPCI, PCI, PCIe and USB interfaces, enabling customers to
build smaller and more sophisticated mobile wireless products
cost-effectively. Ralink's patented MIMObility(TM) technology
extends Wi-Fi applications from traditional PC networking to a
range of digital multimedia and handheld devices including cell
phones, PDAs, cameras, print servers, HDTV and video game players.
Ralink Technology is headquartered Hsinchu, Taiwan, with an R&D
center in Cupertino, California. For more information, visit Ralink
at www.ralinktech.com or send email to info@ralinktech.com.
Forward-Looking Statements
This release contains statements that are forward-looking within
the meaning of Section 27A of the Securities Act of 1933, as
amended, and Section 21E of the Securities Exchange Act of 1934, as
amended, including statements regarding the number of Ralink
package components that will be tested in production by the end of
this year, statements regarding the utilization of the versatile
capability of the D40 RF, statements regarding Ralink's outsource
assembly and test partners in Taiwan, statements regarding Ralink's
growth in retail and PC markets and statements regarding our
expectation that we will be able to meet future demand from Ralink
with our Diamond platforms. These forward-looking statements
involve important factors that could cause our actual results to
differ materially from those in the forward-looking statements.
Such important factors involve risks and uncertainties including,
but not limited to, unanticipated challenges in assessing business
conditions and the overall market, unanticipated difficulties in
the completion of the transaction, cyclicality and downturns in the
semiconductor industry, the timing of new technology, fluctuation
in customer demand, timing and volume of orders and shipments,
competition and pricing pressures, and reliability and quality
issues. Reference is made to the discussion of risk factors
detailed in our filings with the Securities and Exchange
Commission, including our reports on Form 10-K and 10-Q. All
projections in this release are based on limited information
currently available to us, which is subject to change. Although any
such projections and the factors influencing them will likely
change, we will not necessarily update the information, since we
are only to provide guidance at certain points during the year.
Actual events or results could differ materially and no reader of
this release should assume later in the quarter that the
information provided today is still valid. Such information speaks
only as of the date of this release.
Credence is a registered trademark and Credence Systems and
Diamond are trademarks of Credence Systems Corporation. Other
trademarks that may be mentioned in this release are the
intellectual property of their respective owners.
Media Relations Contact: Brenda Ropoulos Communications Director
Credence Systems Corporation Phone: 408-635-4309 FAX: 408-635-4986
E-mail: Email Contact Ralink Contact Information: Vivien Huang
Phone: +886-35600868 ext 1605 E-mail: Email Contact
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