Credence Diamond MultiWave Wins Best New Product Award From Advanced Packaging
23 Julho 2008 - 12:00PM
Marketwired
MILPITAS, CA , a provider of test solutions for the worldwide
consumer semiconductor industry, announced today that its
innovative MultiWave instrument for the Diamond test platform has
received the Advanced Packaging Best New Product Award in the Test
and Services category. MultiWave integrates the functionality of
multiple instruments into one multi-channel arbitrary waveform
generator and digitizer unit to provide the industry's most
cost-effective mixed-signal solution for multisite testing of
highly integrated system-in-package (SiP) and system-on-chip (SoC)
devices.
"We are committed to offering our customers the best value in
test, and the Diamond MultiWave instrument solves a full range of
testing challenges for cost competitive markets. High-level
integration combined with the lowest cost per channel help to
address the relentless pressure to reduce the cost of test," said
Lavi Lev, president and CEO of Credence. "We are delighted that
Advanced Packaging has recognized the excellence of the Diamond
MultiWave by presenting us with this award."
Celebrating excellence in semiconductor packaging, the Advanced
Packaging Awards are presented to the finest examples of creative
advancement in semiconductor technology.
"We congratulate Credence on their win of the prestigious Best
New Product award in the Testing Equipment and Services category,"
stated Gail Flower, editor-in-chief, Advanced Packaging magazine.
"Advanced Packaging is proud to continue its tradition of
recognizing excellence in this segment of the industry. In recent
years, innovations in advanced packaging processes, materials, and
equipment have been driving the semiconductor industry forward. Now
more than ever, it's important to acknowledge the achievements of
these innovators."
The Diamond MultiWave provides a cost-optimized mixed-signal
solution for multisite testing, incorporating four arbitrary
waveform generators and four digitizers into a single compact
instrument. MultiWave allows for fully parallel, concurrent testing
of audio and video SiP and SoC components. This enables the
significant cost of test reductions demanded by very competitive
markets, while also offering maximum fault coverage with minimum
test time. Additionally, the Diamond MultiWave helps customers
leverage complex SiP technology, which is increasingly being used
in new consumer product designs to optimize overall system cost and
efficiency.
The Diamond test platform -- including the ten-slot Diamond 10
and forty-slot Diamond 40 -- delivers unprecedented performance and
flexibility. An innovative, high-throughput, multi-purpose wafer
sort and final test solution, the Diamond platform is specifically
designed to address the economic requirements of the
ultra-competitive consumer mixed-signal device markets. The Diamond
is also optimized for the 200-Mbps probe market and supports
massive multisite production of devices such as microcontrollers,
wireless baseband ICs, display driver controllers, etc.
About Credence
Credence Systems Corporation is a global provider of automated
test equipment (ATE) solutions to the high growth, consumer
semiconductor industry. Credence is committed to deliver the
highest standards of value -- an optimal combination of technology,
turn-around time, reliability, ease of use, service and support --
to every customer, which enables important cost and performance
advantages for integrated device manufacturers (IDMs), wafer
foundries, outsource assembly and test (OSAT) suppliers and fabless
chip companies worldwide. An ISO 9001-certified company with a
presence in 20 countries, Credence is headquartered in Milpitas,
California. More information is available at
http://www.credence.com.
Credence is a registered trademark of Credence Systems
Corporation. Other trademarks that may be mentioned in this release
are the intellectual property of their respective owners.
Media Relations Contact: Brenda Ropoulos Communications Director
Credence Systems Corporation Phone: 408-635-4309 FAX: 408-635-4986
E-mail: Email Contact
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