CyberOptics to Deliver Technical Presentation at the Heterogeneous Integration Summit by SEMICON Taiwan
15 Agosto 2022 - 10:00AM
Business Wire
The company will also unveil new WaferSense®
and ReticleSense® Auto Teach Systems™ (ATS2™ and ATSR™)
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions will share a technical presentation at the Heterogeneous
Integration Global Summit organized by SEMICON Taiwan. The company
will also exhibit WaferSense® and ReticleSense® sensors and feature
the WX3000™ Metrology and Inspection system in booths I2228, I2110,
I2126 and I2160 at TaiNEX 1, Taipei, September 14-16.
Dr. Subodh Kulkarni, President and CEO, CyberOptics, will
present ‘High-precision 3D sensing for semiconductor bump height
uniformity measurement before photo resist’ in the technical track
‘3D Heterogeneous integration (HI) driving packaging enabling
technologies’ on September 16 at 2:35pm local time.
The semiconductor packaging industry continues to advance, with
new designs adding more layers, finer features and more I/O
channels for higher bandwidth and lower power consumption.
Manufacturers face an increasing need for high-precision inspection
and measurement to detect defects and improve process control.
The presentation will focus on measuring bump height uniformity
before the photo resist using the NanoResolution Multi-Reflection
Suppression® (MRS®) sensor technology. The unique optical
architecture of the MRS sensor and the system’s proprietary image
fusing and processing algorithms provide highly accurate 3D
characterization that is several times faster than conventional
PSP. The sensor compares data from multiple perspectives and fringe
frequencies to identify and reject spurious signals from shiny and
reflective surfaces, which is critical for highly accurate
inspection and metrology. The presentation will also elaborate on
the needs and challenges for various AP applications and how the
technology can improve yields, processes and quality.
At the show, the company will feature the WX3000™ Metrology and
Inspection system powered by the 3 µm NanoResolution MRS sensor
that provides sub-micrometer accuracy on features as small as 25µm.
The system is specifically designed for WLP and AP applications.
While retaining its ability to reject spurious multiple
reflections, it adds the ability to capture and analyze specular
reflections from shiny surfaces of solder balls, bumps and pillars,
allowing highly accurate inspection and metrology of these critical
packaging features. Fast, 100% 3D/2D inspection and metrology can
be conducted with throughput greater than 25 wafers (300mm) per
hour, 2-3X faster than alternative solutions.
The new WaferSense® Auto Teaching System (ATS2) and
ReticleSense® Auto Teaching System (ATSR) will also be unveiled at
the show. Process and equipment engineers can speed accurate wafer
and reticle hand-off teaching for proper semiconductor alignment
and set-up. The thinner ATS2 and the ATSR can “see inside in
real-time to capture three dimensional off-set data (x,y,z) to
quickly teach wafer and reticle transfer positions – all without
opening the tool. Semiconductor fabs can significantly improve
their yields and processes.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading-edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible world-wide recession or
depression resulting from the economic consequences of the COVID-19
pandemic; the negative effect on our revenue and operating results
of the COVID-19 crisis on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and China and other countries; the timing of
orders and shipments of our products, particularly our 3D MRS
SQ3000 and SQ3000+ Multi-Function systems and MX systems for memory
module inspection; increasing price competition and price pressure
on our product sales, particularly our inspection and metrology
systems; the level of orders from our OEM customers; the
availability of parts required to meet customer orders;
unanticipated product development challenges; the effect of world
events on our sales, the majority of which are from foreign
customers; rapid changes in technology in the electronics and
semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 and SQ3000+ Multi-Function systems
and products for semiconductor inspection and metrology; costly and
time consuming litigation with third parties related to
intellectual property infringement; the negative impact on our
customers and suppliers due to past and future terrorist threats
and attacks and any acts of war; the impact of lower gross margin
MX3000 orders on our consolidated gross margin percentage in any
future period; risks related to cancellation or renegotiation of
orders we have received; and other factors set forth in the
Company’s filings with the Securities and Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20220815005189/en/
Carla Furanna Vice President of Global Marketing
952-820-5837
CyberOptics (NASDAQ:CYBE)
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