ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry
08 Outubro 2018 - 10:30AM
Electro Scientific Industries, Inc. (Nasdaq: ESIO), an innovator in
laser-based manufacturing solutions for the micro-machining
industry, today announced the availability of its new CapStone™
flexible printed circuit board (PCB) laser processing system, which
offers 2X throughput improvement over its predecessor for
processing blind and through hole vias ̶ the highest in the
industry.
“Flexible printed circuit (FPC) manufacturers will get a
significant advantage with CapStone,” said John Williams, ESI’s
vice president of marketing. “Our marketing and engineering teams
focused on the areas that would make the biggest impact on our
customers’ productivity, pairing our newest beam control
capabilities with the latest laser technology to deliver
substantial gains. Doubling throughput not only enables FPC
manufacturers to meet aggressive production schedules, but also
allows them to add capacity with a smaller factory footprint, less
capital expenditure and less recurring expense. This efficiency
gain will drop right down to our customer’s bottom line.”
CapStone helps manufacturers keep pace with evolving technology
requirements, such as the increasing use of blind vias and
next-generation flexible materials. ESI’s new DynaClean™ beam
positioning feature, enabled by its patented esiLens™ technology,
reduces unproductive beam movement and provides multiple focus
settings at every location. ESI’s newest-generation beam
positioning technology, AcceleDrill™, takes advantage of the high
power and high repetition rate of the esiFlex™ laser to deliver
unprecedented processing efficiency. Combined, these technologies
allow FPC manufacturers to double their processing throughput
without compromising quality, substantially lowering per-panel
processing costs while maintaining high yields across a range of
applications.
“The new CapStone solution leverages our extensive intellectual
property portfolio and laser-material interaction expertise
developed over several decades of experience in laser-based PCB
processing. It expands our product offering to address important
emerging applications in flex PCB manufacturing,” said Williams.
“We expect the CapStone system to meet our customers’ needs well
into the future.”
CapStone systems are available immediately, either directly
through ESI or through ESI channel partners world-wide. For more
information please visit: http://bit.ly/2O6uS3Q.
About ESI, Inc. ESI’s manufacturing systems are
designed to enable manufacturers of electronic components and
devices to optimize their production capabilities and commercialize
technologies through laser processing. ESI’s systems deliver more
control, greater flexibility and more precise processing of a wider
range of materials. The result is higher production quality, faster
throughput, and higher yields, allowing customers to more easily
meet new and challenging customer requirements, consistently meet
aggressive production goals and better control costs. ESI is
headquartered in Portland, Oregon, with global operations from
the Pacific Northwest to the Pacific Rim. More
information is available at www.esi.com.
Electro Scientific Industries and ESI are registered trademarks
of Electro Scientific Industries, Inc. All other trade names
referenced are the service marks, trademarks or registered
trademarks of their respective companies.
ESI Company Contact: Dale PaulinMarketing
Operations ManagerPhone: 503-781-8881Email: paulind@esi.com
Agency Contact: Sandy FewkesMindWrite
Communications, Inc.Phone: 408.529.9685Email:
sandy@mind-write.com
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