SPTS Technologies’ Versalis fxP Multi-Technology System Selected by Mapper Lithography for New Russian Fab
24 Novembro 2014 - 8:48AM
Business Wire
SPTS’ Etch and PECVD Process Solutions Key to
Production of E-Beam Lenses for Maskless Lithography
SPTS Technologies, an Orbotech company and a supplier of
advanced wafer processing solutions for the global semiconductor
industry and related markets, today announced that Mapper
Lithography has selected SPTS’ etch and low temperature chemical
vapor deposition (CVD) systems on a Versalis fxP multi-technology
platform for their new fab in Moscow. Mapper will use SPTS’ deep
reactive ion etch (DRIE) module to create through silicon via holes
with high dimensional accuracy, a critical and essential
requirement in the production of electron beam (e-beam) lenses for
their groundbreaking maskless lithography technology. Mapper also
selected SPTS’ plasma enhanced CVD system (PECVD) because it allows
for a lower deposition temperature than competing systems, enabling
a novel integration scheme.
“Mapper’s e-beam lenses are based on high precision holes
through silicon wafers,” stated Dave Thomas, SPTS’ marketing
director for etch products. “The Rapier DRIE PM is uniquely able to
provide the required high-level of profile control, selectivity and
uniformity needed for these critical features. Furthermore, Rapier
achieves this at productive etch rates, ensuring the highest yields
and lowest cost of ownership possible for Mapper.”
“Our maskless lithography tools utilize an innovative multiple
E-beam technology with which semiconductors can be manufactured in
a more cost effective fashion,” stated Denis Shamiryan,
Manufacturing Director at Mapper Lithography. “It makes the
traditionally used mask redundant and combines high resolution with
high productivity. SPTS’DRIE solutions deliver the etch rate, etch
profile and positional accuracy during the silicon etching process
which are vital to our approach.”
SPTS Technologies’ Versalis fxP multi-technology cluster
platform offers many benefits, including lower cost of ownership
and smaller footprint. By combining DRIE and CVD on the same
platform, Mapper significantly reduced their capital outlay
compared to buying traditionally configured single technology
systems. Additionally, Mapper is benefiting from SPTS’ single
chamber multi-process capability as the same CVD module can also be
used to deposit multiple film types, including silicon oxide,
silicon nitride and amorphous silicon with outstanding adhesion and
particle performance. With critical elements of Mapper’s product
sensitive to temperature, the ability to deposit high quality films
at temperatures <150ºC made it a compelling solution for this
application.
About SPTS Technologies
SPTS Technologies, an Orbotech (NASDAQ:ORBK) company, designs,
manufactures, sells, and supports etch, PVD, CVD and thermal wafer
processing solutions for the MEMS, advanced packaging, LEDs, high
speed RF on GaAs, and power management device markets. With
manufacturing facilities in Newport, Wales, Allentown,
Pennsylvania, and San Jose, California, the company operates across
19 countries in Europe, North America and Asia-Pacific. For more
information about SPTS Technologies, please visit www.spts.com
###
SPTS TechnologiesDestanie ClarkeTel: +44 7951
203278Destanie.Clarke@orbotech.com
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