Orbotech Wins $18M in Frame Agreements from Two Leading PCB Makers
21 Março 2013 - 5:04AM
Business Wire
Orbotech Ltd. (NASDAQ/GSM: ORBK) today announced that it has
signed major frame agreements, totaling approximately $18 million
in value, with two leading printed circuit board (“PCB”)
makers in Taiwan and China for the mass production of high density
interconnect PCBs.
These orders, which are expected to include multiple Paragon™
laser direct imaging (“LDI”) and automated optical
inspection systems, as well as related digital production tools,
reflect an increasing level of capital investment by PCB customers
in the most up-to-date Orbotech technology used in the manufacture
of advanced PCBs for highly sophisticated electronic devices.
“We are gratified that these customers, which are major
suppliers to several of the world’s top electronics companies, have
once again selected Orbotech solutions as part of their strategic
growth plan,” commented Mr. Richard Klapholz, Corporate Executive
Vice President of Electronics Business at Orbotech Ltd. Mr.
Klapholz added: “PCB manufacturers are coming to realize that the
significant challenges involved in the mass production of high
quality, ultra-thin and increasingly complex boards can now only be
met by the use of systems having LDI capabilities. The highly
competitive nature of the advanced micro manufacturing segment
requires continuous development of new production techniques that
can keep pace with the rapid advances in electronics innovation and
we are very pleased to be partnering with our customers in this
process.”
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of
the electronics industry supply chain, as an innovator of enabling
technologies used in the manufacture of the world’s most
sophisticated consumer and industrial products, for over 30 years.
The Company is a leading provider of yield-enhancing and production
solutions, primarily for manufacturers of printed circuit boards,
flat panel displays and other electronic components; and today,
virtually every electronic device is produced using Orbotech
technology. The Company also applies its core expertise and
resources in other advanced technology areas, including character
recognition for check and forms processing and solar photovoltaic
manufacturing. Headquartered in Israel and operating from multiple
locations internationally, Orbotech’s highly talented and
inter-disciplinary professionals design, manufacture, sell and
service the Company’s end-to-end portfolio of solutions for the
benefit of customers the world over. For more information please
see the Company’s filings with the U.S. Securities and Exchange
Commission at www.sec.gov. and visit the Company’s corporate
website at www.orbotech.com. The corporate website is not
incorporated herein by reference and is included as an inactive
textual reference only.
Cautionary Statement Regarding
Forward-Looking Statements
Except for historical information, the matters discussed in this
press release are forward-looking statements within the meaning of
the U.S. Private Securities Litigation Reform Act of 1995. These
statements relate to, among other things, future prospects,
developments and business strategies and involve certain risks and
uncertainties. The words “anticipate,” “believe,” “could,” “will,”
“plan,” “expect” and “would” and similar terms and phrases,
including references to assumptions, have been used in this press
release to identify forward-looking statements. These
forward-looking statements are made based on management’s
expectations and beliefs concerning future events affecting
Orbotech and are subject to uncertainties and factors relating to
its operations and business environment, all of which are difficult
to predict and many of which are beyond the Company’s control. Many
factors could cause the actual results to differ materially from
those projected including, without limitation, the timing, terms
and success of any strategic transaction, the outcome and impact of
the pending criminal matter and ongoing investigation in Korea,
including any impact on existing or future business opportunities
in Korea and elsewhere, any civil actions related to the Korean
matter brought by third parties, including the Company’s customers,
which may result in monetary judgments or settlements, expenses
associated with the Korean matter, cyclicality in the industries in
which the Company operates, the Company’s production capacity,
timing and occurrence of product acceptance, fluctuations in
product mix, worldwide economic conditions generally, especially in
the industries in which the Company operates, the timing and
strength of product and service offerings by the Company and its
competitors, changes in business or pricing strategies, changes in
the prevailing political and regulatory framework in which the
relevant parties operate or in economic or technological trends or
conditions, including currency fluctuations, inflation and consumer
confidence, on a global, regional or national basis, the level of
consumer demand for sophisticated devices such as smartphones,
tablets and other electronic devices and other risks detailed in
the Company’s SEC reports, including the Company’s Annual Report on
Form 20-F for the year ended December 31, 2012. The Company assumes
no obligation to update the information in this press release to
reflect new information, future events or otherwise, except as
required by law.
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