TLPC Telpac Industries Inc (GM)

Telpac Industries, Inc. (Pink Sheets:TLPC) today announced that it is enhancing their payment platform technology for the international money remittance market. The money transfer industry sends funds between an individual to family members in the United States and other countries. David Teuma, CEO of Telpac Industries states, "The growth of the international money remittance market presents an opportunity for Telpac to utilize our intellectual property as a system to process money remittance transactions. The market size of this industry will exceed $400 billion in 2013 and we are positioning ourselves as a processor for this segment."  Telpac is currently developing a project targeting the Asia Pacific region.

Telpac acquired its payment processing platform in April 2012. This multi-million dollar software platform provides for customized financial payment solutions for Internet, mobile, stored value, and micro-payment applications.  Transactions within the system include ACH, Mobile Wallet, P2P, Virtual and Card Based Programs.

ABOUT TELPAC INDUSTRIES, INC (TLPC)

Telpac Industries, Inc. is an innovative global provider of mobile payment and electronic commerce products and services.  Telpac is a fast growing global mobile media company, with a full focus on targeted social networks. Telpac has developed a vertically integrated service offering targeted mobile social networks, mobile content, entertainment and social mobile games, mobile micro payments, and advanced mobile technology platforms.  For more information go to: www.telpacindustriesinc.com.

Forward-looking Statements

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Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. Except as required by applicable laws, including the securities laws of the United States, we do not intend to update any of the forward-looking statements so as to conform these statements to actual results.

CONTACT: David Teuma
         email: d.teuma@att.net