YAVNE, Israel, May 31, 2016 /PRNewswire/ --
ORBOTECH LTD. (NASDAQ: ORBK), a leading provider of process
innovation technologies, solutions and equipment serving the global
electronics manufacturing industry, today launched the Nuvogo Fine
at JPCA 2016 in Tokyo, Japan. The
Nuvogo Fine is specifically designed for new production methods and
technologies, in particular for advanced high density interconnect
(HDI), including modified semi-additive process (mSAP) and flexible
printed circuits (FPC) at exceptionally high throughput on all
types of resists. As the industry continues to move towards
thinner, smarter and smaller devices and existing production
technologies are reaching their limits, new production processes
such as mSAP are enabling the high-volume manufacture of ultra-fine
resolution printed circuit boards (PCB) to achieve superior imaging
quality. This next-generation solution is designed to enable this
process as the PCB manufacturing industry adapts to mSAP to tackle
these upcoming challenges.
"As the industry moves toward wearables and smartphones with
increasingly thinner form factors and higher functionality, HDI
manufacturing processes must adapt in order to support this
demand," said Arik Gordon, Corporate
Vice President and President of Orbotech's PCB Division.
"Orbotech's quick response time to these changing dynamics, ensures
our ability to stay at the forefront of PCB manufacturing. The
Nuvogo Fine provides exceptional precision to support today's
advanced designs with streamlined production processes. This
winning combination will, in turn, ensure that our customers stay
ahead of the competition and answer designers' needs with fast
throughput, increased yield and lower total cost of ownership."
About the Nuvogo Fine
The Nuvogo Fine is driven by Orbotech's proven state-of-the-art
optics, mechanics and electronics. Capable of providing a line
width of 10μm and yields of up to 5500 panels per production line,
per day, the solution offers exceptionally fast panel production
speeds, accelerating time-to-market while enabling a very low
cost-per-print.
With its dual table, the Nuvogo Fine is able to print in
advanced scaling modes with nearly no loss of throughput. The
system is built to streamline and optimize high volume PCB
production of extremely dense designs, offering advanced quality
and efficiency features. In addition, the Nuvogo Fine boosts
registration accuracy enabling the high precision stacking of
microvias.
Enabling Industry Leading Precision with
Exceptional Yield
Powered by Orbotech's MultiWave Laser Technology™ and Large Scan
Optics Technology™ (LSO), the Nuvogo Fine offers precision line
quality and pattern uniformity without sacrificing production
speed. The field-proven LSO technology enables line structure and
uniformity with exceptional depth-of-focus (DoF) using a single
panel scan, ensuring superior results even on the most challenging
of topologies. The MultiWave Laser Technology™ produces sharper
edge patterns and maximizes flexibility by matching any resist to
fit all practices. The adaptable multi-wavelength laser offers
superior uniformity of in-line structure quality.
Orbotech's advanced manufacturing technologies provide PCB
manufacturers with the precision and accuracy needed for the fast
growing electronic devices industry. The Company remains focused on
the need to maintain exceptional throughput and yield to ensure
manufacturers' profitability and to satisfy end user requirements
for fast time-to-market.
The Nuvogo Fine is now available to customers worldwide.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling
technologies used in the manufacture of the world's most
sophisticated consumer and industrial products throughout the
electronics and adjacent industries. The Company is a leading
provider of yield enhancement and production solutions for
electronics reading, writing and connecting, used by manufacturers
of printed circuit boards, flat panel displays, advanced packaging,
micro-electro-mechanical systems and other electronic components.
Virtually every electronic device in the world is produced using
Orbotech systems. For more information,
visit http://www.orbotech.com
Cautionary Statement Regarding Forward-Looking
Statements
Except for historical information, the matters discussed in
this press release are forward-looking statements within the
meaning of the U.S. Private Securities Litigation Reform Act of
1995. These statements relate to, among other things, future
prospects, developments and business strategies and involve certain
risks and uncertainties. The words
"anticipate," "believe,"
"could," "will,"
"plan," "expect"
and "would" and similar terms and
phrases, including references to assumptions, have been used in
this press release to identify forward-looking statements. These
forward-looking statements are made based on
management's expectations and beliefs concerning
future events affecting Orbotech and are subject to uncertainties
and factors relating to Orbotech's operations and
business environment, all of which are difficult to predict and
many of which are beyond the Company's control. Many
factors could cause the actual results to differ materially from
those projected including, without limitation, cyclicality in the
industries in which the Company operates, the
Company's production capacity, timing and occurrence
of product acceptance (the Company defines
'bookings' and
'backlog' as purchase arrangements with
customers that are based on mutually agreed terms, which, in some
cases for bookings and backlog, may still be subject to completion
of written documentation and may be changed or cancelled by the
customer, often without penalty), fluctuations in product mix,
worldwide economic conditions generally, especially in the
industries in which the Company operates, the timing and strength
of product and service offerings by the Company and its
competitors, changes in business or pricing strategies, changes in
the prevailing political and regulatory framework in which the
relevant parties operate or in economic or technological trends or
conditions, including currency fluctuations, inflation and consumer
confidence, on a global, regional or national basis, the level of
consumer demand for sophisticated devices such as smartphones,
tablets and other electronic devices as well as automobiles, the
Company's global operations and its ability to comply
with varying legal, regulatory, exchange, tax and customs regimes,
the Company's ability to achieve strategic
initiatives, including related to its acquisition strategy, the
Company's debt and corporate financing activities;
the final timing, outcome and impact of the criminal matter
expected in mid- to-late 2016 and ongoing investigation in Korea,
including any impact on existing or future business opportunities
in Korea and elsewhere, any civil actions related to the Korean
matter brought by third parties, including the
Company's customers, which may result in monetary
judgments or settlements, expenses associated with the Korean
Matter, ongoing or increased hostilities in Israel and the surrounding areas, and
other risks detailed in the Company's SEC reports,
including the Company's Annual Report on Form 20-F
for the year ended December 31, 2015,
and subsequent SEC filings. The Company assumes no obligation to
update the information in this press release to reflect new
information, future events or otherwise, except as required
by law.
COMPANY CONTACTS:
Anat Earon-Heilborn
Director of Investor Relations
Orbotech Ltd.
Tel: +972-8-942-3582
Investor.relations@orbotech.com
Tally Kaplan Porat
Head of Corporate Marketing
Orbotech Ltd.
Tel: +972-8-942-3603
Tally-Ka@orbotech.com
SOURCE Orbotech Ltd.