AI runs best on Intel across the compute
continuum from the data center, cloud and network to the edge and
PC.
NEWS HIGHLIGHTS
- Launches Intel® Xeon® 6 processors with Efficient-cores
(E-cores), delivering performance and power efficiency for
high-density, scale-out workloads in the data center. Enables 3:1
rack consolidation, rack-level performance gains of up to 4.2x and
performance per watt gains of up to 2.6x1.
- Announces pricing for Intel® Gaudi® 2 and Intel® Gaudi® 3 AI
accelerator kits, delivering high performance with up to one-third
lower cost compared to competitive platforms2. The combination of
Xeon processors with Gaudi AI accelerators in a system offers a
powerful solution for making AI faster, cheaper and more
accessible.
- Unveils Lunar Lake client processor architecture to continue to
grow the AI PC category. The next generation of AI PCs – with
breakthrough x86 power efficiency and no-compromise application
compatibility – will deliver up to 40% lower system-on-chip (SoC)
power when compared with the previous generation3.
Today at Computex, Intel unveiled cutting-edge technologies and
architectures poised to dramatically accelerate the AI ecosystem –
from the data center, cloud and network to the edge and PC. With
more processing power, leading-edge power efficiency and low total
cost of ownership (TCO), customers can now capture the complete AI
system opportunity.
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At Computex in Taipei, Taiwan, on June 4,
2024, Intel launched the Intel Xeon 6 processors with
Efficient-cores (E-cores). For companies looking to refresh aging
infrastructure to help reduce costs and free up space, Intel Xeon 6
with E-cores offers significant rack density advantages, enabling a
3-to-1 rack-level consolidation. (Credit: Intel Corporation)
“AI is driving one of the most consequential eras of innovation
the industry has ever seen,” said Intel CEO Pat Gelsinger. “The
magic of silicon is once again enabling exponential advancements in
computing that will push the boundaries of human potential and
power the global economy for years to come.”
More: Intel at Computex 2024 (Press Kit)
Gelsinger continued, “Intel is one of the only companies in the
world innovating across the full spectrum of the AI market
opportunity – from semiconductor manufacturing to PC, network, edge
and data center systems. Our latest Xeon, Gaudi and Core Ultra
platforms, combined with the power of our hardware and software
ecosystem, are delivering the flexible, secure, sustainable and
cost-effective solutions our customers need to maximize the immense
opportunities ahead.”
Intel Enables AI Everywhere
During his Computex keynote, Gelsinger highlighted the benefits
of open standards and Intel’s powerful ecosystem helping to
accelerate the AI opportunity. He was joined by luminaries and
industry-leading companies voicing support, including Acer Chairman
and CEO Jason Chen, ASUS Chairman Jonney Shih, Microsoft Chairman
and CEO Satya Nadella, and Inventec’s President Jack Tsai, among
others.
Gelsinger and others made it clear that Intel is revolutionizing
AI innovation and delivering next-generation technologies ahead of
schedule. In just six months, the company went from launching 5th
Gen Intel® Xeon® processors to introducing the inaugural member of
the Xeon 6 family; from previewing Gaudi AI accelerators to
offering enterprise customers a cost-effective, high-performance
generative AI (GenAI) training and inference system; and from
ushering in the AI PC era with Intel® Core™ Ultra processors in
more than 8 million devices to unveiling the forthcoming client
architecture slated for release later this year.
With these developments, Intel is accelerating execution while
pushing the boundaries of innovation and production speed to
democratize AI and catalyze industries.
Modernizing the Data Center for AI: Intel Xeon 6 Processors
Improve Performance and Power Efficiency for High-Density,
Scale-Out Workloads
As digital transformations accelerate, companies face mounting
pressures to refresh their aging data center systems to capture
cost savings, achieve sustainability goals, maximize physical floor
and rack space, and create brand-new digital capabilities across
the enterprise.
The entire Xeon 6 platform and family of processors is
purpose-built for addressing these challenges with both E-core
(Efficient-core) and P-core (Performance-core) SKUs to address the
broad array of use cases and workloads, from AI and other
high-performance compute needs to scalable cloud-native
applications. Both E-cores and P-cores are built on a compatible
architecture with a shared software stack and an open ecosystem of
hardware and software vendors.
The first of the Xeon 6 processors to debut is the Intel Xeon 6
E-core (code-named Sierra Forest), which is available beginning
today. Xeon 6 P-cores (code-named Granite Rapids) are expected to
launch next quarter.
With high core density and exceptional performance per watt,
Intel Xeon 6 E-core delivers efficient compute with significantly
lower energy costs. The improved performance with increased power
efficiency is perfect for the most demanding high-density,
scale-out workloads, including cloud-native applications and
content delivery networks, network microservices and consumer
digital services.
Additionally, Xeon 6 E-core has tremendous density advantages,
enabling rack-level consolidation of 3-to-1, providing customers
with a rack-level performance gain of up to 4.2x and performance
per watt gain of up to 2.6x when compared with 2nd Gen Intel® Xeon®
processors on media transcode workloads1. Using less power and rack
space, Xeon 6 processors free up compute capacity and
infrastructure for innovative new AI projects.
Fact Sheet: Intel Xeon 6 Processors
Providing High Performance GenAI at Significantly Lower Total
Cost with Intel Gaudi AI Accelerators
Today, harnessing the power of generative AI becomes faster and
less expensive. As the dominant infrastructure choice, x86 operates
at scale in nearly all data center environments, serving as the
foundation for integrating the power of AI while ensuring
cost-effective interoperability and the tremendous benefits of an
open ecosystem of developers and customers.
Intel Xeon processors are the ideal CPU head node for AI
workloads and operate in a system with Intel Gaudi AI accelerators,
which are purposely designed for AI workloads. Together, these two
offer a powerful solution that seamlessly integrates into existing
infrastructure.
As the only MLPerf-benchmarked alternative to Nvidia H100 for
training and inference of large language models (LLM), the Gaudi
architecture gives customers the GenAI performance they seek with a
price-performance advantage that provides choice and fast
deployment time at lower total cost of operating.
A standard AI kit including eight Intel Gaudi 2 accelerators
with a universal baseboard (UBB) offered to system providers at
$65,000 is estimated to be one-third the cost of comparable
competitive platforms. A kit including eight Intel Gaudi 3
accelerators with a UBB will list at $125,000, estimated to be
two-thirds the cost of comparable competitive platforms4.
Intel Gaudi 3 accelerators will deliver significant performance
improvements for training and inference tasks on leading GenAI
models, helping enterprises unlock the value in their proprietary
data. Intel Gaudi 3 in an 8,192-accelerator cluster is projected to
offer up to 40% faster time-to-train5 versus the equivalent size
Nvidia H100 GPU cluster and up to 15% faster training6 throughput
for a 64-accelerator cluster versus Nvidia H100 on the Llama2-70B
model. In addition, Intel Gaudi 3 is projected to offer an average
of up to 2x faster inferencing7 versus Nvidia H100, running popular
LLMs such as Llama-70B and Mistral-7B.
To make these AI systems broadly available, Intel is
collaborating with at least 10 top global system providers,
including six new providers who announced they’re bringing Intel
Gaudi 3 to market. Today’s new collaborators include Asus, Foxconn,
Gigabyte, Inventec, Quanta and Wistron, expanding the production
offerings from leading system providers Dell, Hewlett Packard
Enterprise, Lenovo and Supermicro.
Accelerating On-Device AI for laptop PCs; New Architecture
Delivers 3x AI Compute and Incredible Power-Efficiency
Beyond the data center, Intel is scaling its AI footprint at the
edge and in the PC. With more than 90,000 edge deployments and 200
million CPUs delivered to the ecosystem, Intel has enabled
enterprise choice for decades.
Today the AI PC category is transforming every aspect of the
compute experience, and Intel is at the forefront of this
category-creating moment. It’s no longer just about faster
processing speeds or sleeker designs, but rather creating edge
devices that learn and evolve in real time – anticipating user
needs, adapting to their preferences, and heralding an entirely new
era of productivity, efficiency and creativity.
AI PCs are projected to make up 80% of the PC market by 2028,
according to Boston Consulting Group. In response, Intel has moved
quickly to create the best hardware and software platform for the
AI PC, enabling more than 100 independent software vendors (ISVs),
300 features and support of 500 AI models across its Core Ultra
platform.
Quickly building on these unmatched advantages, the company
today revealed the architectural details of Lunar Lake – the
flagship processor for the next generation of AI PCs. With a
massive leap in graphics and AI processing power, and a focus on
power-efficient compute performance for the thin-and-light segment,
Lunar Lake will deliver up to 40% lower SoC power3 and more than 3
times the AI compute8. It’s expected to ship in the third quarter
of 2024, in time for the holiday buying season.
Lunar Lake’s all-new architecture will enable:
- New Performance-cores (P-cores) and Efficient-cores (E-cores)
deliver significant performance and energy efficiency
improvements.
- A fourth-generation Intel neural processing unit (NPU) with up
to 48 tera-operations per second (TOPS) of AI performance. This
powerful NPU delivers up to 4x AI compute over the previous
generation, enabling corresponding improvements in generative
AI.
- An all-new GPU design, code-named Battlemage, combines two new
innovations: Xe2 GPU cores for graphics and Xe Matrix Extension
(XMX) arrays for AI. The Xe2 GPU cores improve gaming and graphics
performance by 1.5x over the previous generation, while the new XMX
arrays enable a second AI accelerator with up to 67 TOPS of
performance for extraordinary throughput in AI content
creation.
- Advanced low-power island, a novel compute cluster and Intel
innovation that handles background and productivity tasks with
extreme efficiency, enabling amazing laptop battery life.
As others prepare to enter the AI PC market, Intel is already
shipping at scale, delivering more AI PC processors through 2024’s
first quarter than all competitors together. Lunar Lake is set to
power more than 80 different AI PC designs from 20 original
equipment manufacturers (OEMs). Intel expects to deploy more than
40 million Core Ultra processors in market this year.
Fact Sheet: Intel Unveils Lunar Lake Architecture
As Gordon Moore famously said, “Whatever has been done, can be
outdone,” and Intel stands as the vanguard of this relentless
pursuit of progress. With global scale spanning client, edge, data
center and cloud, a robust ecosystem grounded in open standards,
and powerful, cost-effective solutions, Intel is not just powering
AI everywhere; it is shaping its future. Today’s announcements are
not just a technological leap, but an invitation to customers and
partners to seize unprecedented possibilities and pioneer the next
era of their own innovations.
Forward-Looking Statements
This release contains forward-looking statements that involve a
number of risks and uncertainties, including with respect to
Intel’s product roadmap and anticipated product sales and
competitiveness and projected growth and trends in markets relevant
to Intel’s business. Such statements involve many risks and
uncertainties that could cause our actual results to differ
materially from those expressed or implied, including those
associated with:
- the high level of competition and rapid technological change in
our industry;
- the significant long-term and inherently risky investments we
are making in R&D and manufacturing facilities that may not
realize a favorable return;
- the complexities and uncertainties in developing and
implementing new semiconductor products and manufacturing process
technologies;
- our ability to time and scale our capital investments
appropriately and successfully secure favorable alternative
financing arrangements and government grants;
- implementing new business strategies and investing in new
businesses and technologies;
- changes in demand for our products;
- macroeconomic conditions and geopolitical tensions and
conflicts, including geopolitical and trade tensions between the US
and China, the impacts of Russia's war on Ukraine, tensions and
conflict affecting Israel and the Middle East, and rising tensions
between mainland China and Taiwan;
- the evolving market for products with AI capabilities;
- our complex global supply chain, including from disruptions,
delays, trade tensions and conflicts, or shortages;
- product defects, errata and other product issues, particularly
as we develop next-generation products and implement
next-generation manufacturing process technologies;
- potential security vulnerabilities in our products;
- increasing and evolving cybersecurity threats and privacy
risks;
- IP risks including related litigation and regulatory
proceedings;
- the need to attract, retain, and motivate key talent;
- strategic transactions and investments;
- sales-related risks, including customer concentration and the
use of distributors and other third parties;
- our significantly reduced return of capital in recent
years;
- our debt obligations and our ability to access sources of
capital;
- complex and evolving laws and regulations across many
jurisdictions;
- fluctuations in currency exchange rates;
- changes in our effective tax rate;
- catastrophic events;
- environmental, health, safety, and product regulations;
- our initiatives and new legal requirements with respect to
corporate responsibility matters; and
- other risks and uncertainties described in this release, our
2023 Form 10-K, and our other filings with the SEC.
Given these risks and uncertainties, readers are cautioned not
to place undue reliance on such forward-looking statements. Readers
are urged to carefully review and consider the various disclosures
made in this release and in other documents we file from time to
time with the SEC that disclose risks and uncertainties that may
affect our business.
Unless specifically indicated otherwise, the forward-looking
statements in this release are based on management's expectations
as of the date of this release, unless an earlier date is
specified, including expectations based on third-party information
and projections that management believes to be reputable. We do not
undertake, and expressly disclaim any duty, to update such
statements, whether as a result of new information, new
developments, or otherwise, except to the extent that disclosure
may be required by law.
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
AI runs best on Intel across the compute continuum from the data
center, cloud and network to the edge and PC as of May 2024, based
on broad compatibility, extensive software options, unique
architecture, and impressive performance of Intel offerings, which
combine to deliver the best overall AI experience, including in
comparison to competitive offerings. See intel.com/performanceindex
for details. Results may vary.
1 See [7T1] at intel.com/processorclaims: Intel® Xeon® 6.
Results may vary.
2 Pricing estimates based on publicly available information and
Intel internal analysis.
3 Disclaimer for footnote: Power measurements are based on Lunar
Lake reference platform using YouTube 4K 30fps AV1. See backup for
details. Results may vary.
4 Pricing guidance for cards and systems is for modeling
purposes only. Please consult your original equipment manufacturer
(OEM) of choice for final pricing. Results may vary based upon
volumes and lead times.
5 Source for Nvidia H100 GPT 3 performance:
https://mlcommons.org/benchmarks/training/, v3.1, closed division
round. Accessed April 30, 2024. Intel Gaudi 3 measurements and
projections by Habana Labs, April 2024; Results may vary Intel
Gaudi 3 performance projections are not verified by MLCommons
Association. The MLPerf name and logo are registered and
unregistered trademarks of MLCommons Association in the United
States and other countries. All rights reserved. Unauthorized use
strictly prohibited. See http://www.mlcommons.org/ for more
information.
6 Source for Nvidia H100 LLAMA2-70B performance
https://developer.nvidia.com/deep-learning-performance-training-inference/training,
April 29, 2024, a “Large Language Model” tab. Intel Gaudi 3
measurements and projections by Habana Labs, April 2024; Results
may vary
7 Source for Nvidia performance: Overview — tensorrt_llm
documentation (nvidia.github.io), May, 2024. Reported numbers are
per GPU. Intel Gaudi 3 projections by Habana Labs, April 2024;
Results may vary
8 Based on total number of platform Tops on Lunar Lake vs. prior
generation.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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version on businesswire.com: https://www.businesswire.com/news/home/20240603799554/en/
Cory Pforzheimer 1-805-895-2281 cory.pforzheimer@intel.com
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