Amkor Advanced Packaging Enables the Car of the Future
13 Junho 2023 - 9:00AM
Business Wire
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of
semiconductor packaging and test services and the #1 automotive
OSAT, is innovating advanced packaging to enable the car of the
future.
The evolution of the enhanced automotive experience has been
dramatic over the past few years—a rise evidenced in car-related
semiconductor sales. In 2015, the auto semiconductor market was
approximately $30B. Since then, it has more than doubled to $68B in
2022 and is expected to continue to grow over the next few years at
a mid-teens compound annual growth rate—representing one of the
highest growth segments in the semiconductor industry. This
increase is driven by higher demand for autonomous functionality,
digital control systems, and vehicle electrification. As the
leading automotive OSAT with more than 40 years of automotive
experience and a broad geographic footprint supporting global and
enabling regional supply chains, Amkor is well positioned to
capture growth from the acceleration of semiconductor content in
cars.
The move toward advanced driver assistance systems (ADAS) and
full autonomy—motivated by regional legislation and consumer
preference—has led automotive manufacturers to install enhanced
safety and convenience features as standard in base models.
Advanced packaging solutions include ADAS to automate aspects of
the driving process like parking assistance, lane positioning and
collision avoidance. ADAS technologies use multiple sensors such as
radar, LIDAR, ultrasonic, and image sensors to improve the safety
of the vehicle. While wirebond continues to be the dominant
interconnect for automotive packages, ADAS modules are increasingly
using advanced interconnect technologies such as flip chip BGA,
wafer level fan-out, and flip chip CSP. Advanced silicon nodes are
growing quickly for ADAS processors with 7 nm already in production
at Amkor and 5 nm solutions expected to be quickly adopted in
automotive applications.
Behind the wheel, consumers want an immersive and interactive
in-car experience that is both entertaining and informative. To
meet demand for this digital control center, Amkor continues to
develop advanced infotainment and telematics package solutions that
offer seamless connectivity, intuitive interfaces, and personalized
experiences. These solutions include flip chip, system in package,
MEMS, and sensors that enable advanced features like in-panel and
heads-up displays, navigation systems, and vehicle-to-everything
systems.
The shift toward vehicle electrification is rapidly gaining
momentum, with governments around the world implementing policies
to reduce emissions and promote sustainable transportation. Amkor
is answering this growing demand with xEV solutions that manage
power conversion from battery to electric drive motors and
powertrain solutions used to manage and reduce fuel consumption and
emissions in non-electric vehicles. Amkor continues to support the
industry with advanced packaging for silicon carbide power devices
and modules and MEMS technologies to realize the needs of
sustainable and efficient vehicles, now and in the future.
Amkor is the #1 automotive OSAT with multiple decades of
automotive experience. With strategically situated manufacturing
locations across Europe, Japan, and southeast Asia—including its
R&D Center of Excellence in Korea—Amkor continues to invest in
factory automation and other Industry 4.0 practices that help meet
the rigorous performance and reliability demands of the automotive
industry. As a US headquartered company, Amkor is well positioned
to add automotive solutions, including power module manufacturing,
in the US as the market matures. Amkor’s global support and local
presence enables it to assist regional automotive manufacturers in
their pursuit of ensuring supply chain stability and delivering the
next-generation automotive solutions that will help them remain
competitive.
“Amkor has a long track record as a trusted partner—and history
of leadership—in the automotive industry,” said Kevin Engel,
Executive Vice President of Business Units at Amkor. “It’s a result
of our continuous investment in infrastructure and R&D,
commitment to our QualityFIRST mindset, and our technology
leadership that uniquely positions us to help enable the cars of
the future.”
“The advanced driving systems in today’s vehicles require
greater processing power as the industry moves toward
software-defined cars—pushing the need for highly complex, advanced
technology platforms with robust device packaging,” said Gary
Hicok, senior vice president of automotive hardware and systems at
NVIDIA. “Its sophisticated design and packaging capabilities make
Amkor a reliable automotive packaging technology provider.”
To learn more about Amkor’s capabilities in the automotive
industry, please visit amkor.com/automotive/.
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers
of outsourced semiconductor packaging and test services. Founded in
1968, Amkor pioneered the outsourcing of IC packaging and test and
is now a strategic manufacturing partner for the world’s leading
semiconductor companies, foundries, and electronics OEMs. Amkor’s
operational base includes production facilities, product
development centers, and sales and support offices located in key
electronics manufacturing regions in Asia, Europe, and the USA. For
more information visit amkor.com.
Forward-Looking Statement Disclaimer
This press release contains forward-looking statements within
the meaning of the federal securities laws, including statements
about the growth of semiconductor content in cars and investment to
support the expected growth. You are cautioned not to place undue
reliance on forward-looking statements. All forward-looking
statements in this press release are made based on our current
expectations, forecasts, estimates and assumptions. Because such
statements include risks and uncertainties, actual results may
differ materially from those anticipated in such forward-looking
statements. Risk factors that could affect the outcome of the
events set forth in these statements are discussed in the company’s
reports filed with or furnished to the Securities and Exchange
Commission. All forward-looking statements attributable to us or
persons acting on our behalf are expressly qualified in their
entirety by this cautionary statement. We assume no obligation to
review or update any forward-looking statements to reflect events
or circumstances occurring after the date of this press release
except as may be required by applicable law.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20230612185761/en/
Investor Relations Jennifer Jue Vice President, Investor
Relations and Finance 480-786-7594 jennifer.jue@amkor.com
Media Relations Christina Parsons Director, Marketing
Communications 480-786-7653 christina.parsons@amkor.com
Social Media: @amkortechnology
Amkor Technology (NASDAQ:AMKR)
Gráfico Histórico do Ativo
De Abr 2024 até Mai 2024
Amkor Technology (NASDAQ:AMKR)
Gráfico Histórico do Ativo
De Mai 2023 até Mai 2024