Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform
31 Janeiro 2024 - 12:45PM
Business Wire
Highlights:
- Thermal, stress and electronics cooling in-design analysis
empowers designers to utilize ECAD and MCAD seamlessly for
multiphysics simulation of electro-mechanical systems
- Convergence of FEM and CFD engines addresses thermal integrity
challenges from the chip to the packaging, to the board and out
through the complete electronic system
- Architected for massively parallel execution, Celsius Studio
achieves up to 10X faster performance than prior solutions
- Seamlessly integrated within Cadence IC, packaging, PCB and
microwave design platforms, Celsius Studio enables in-design
thermal analyses as well as final signoff
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced
Cadence® Celsius™ Studio, the industry’s first complete AI thermal
design and analysis solution for electronic systems. Celsius Studio
addresses thermal analysis and thermal stress for 2.5D and 3D-ICs
and IC packaging, in addition to electronics cooling for PCBs and
complete electronic assemblies. While current product offerings
consist mostly of disparate point tools, Celsius Studio introduces
an entirely new approach with a unified platform that lets
electrical and mechanical/thermal engineers concurrently design,
analyze and optimize product performance without the need for
geometry simplification, manipulation and/or translation.
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The industry’s first complete AI thermal
design and analysis solution for electronic systems, Cadence®
Celsius™ Studio addresses thermal analysis and thermal stress for
2.5D and 3D-ICs and IC packaging, in addition to electronics
cooling for PCBs and complete electronic assemblies. (Graphic:
Business Wire)
Celsius Studio brings a new system-level thermal integrity
solution into the marketplace, converging electro-thermal
co-simulation, electronics cooling and thermal stress into one
cohesive offering. Made possible by Cadence’s acquisition of Future
Facilities in 2022, best-in-class electronics cooling technology is
now accessible to electrical and mechanical engineers.
Additionally, the ability to employ Celsius Studio seamlessly for
in-design multiphysics analysis empowers designers to identify
thermal integrity issues early in the design process and
efficiently leverage generative AI optimization and novel modeling
algorithms to determine ideal thermal designs.
The result is a streamlined workflow that improves
collaboration, reduces design iterations and allows predictable
design schedules, which in turn reduces turnaround times and
accelerates time to market. Celsius Studio delivers the following
benefits:
- ECAD/MCAD Unification – Provides seamless integration of
design files with no simplification as well as streamlined
workflows for fast and efficient in-design analysis
- AI Design Optimization – Cadence Optimality™ Intelligent
System Explorer’s AI technology within Celsius Studio enables fast
and efficient exploration of the full design space to converge on
the optimal design
- In-Design Analysis of 2.5D and 3D-IC Packages – Delivers
unprecedented capacity to analyze any 2.5D and 3D-IC packages
without any simplification or accuracy loss
- Micro-to-Macro Modeling – The first solution capable of
modeling structures as small as the IC and its power distribution
and as large as the chassis where the PCB(s) are placed
- Large-Scale Simulation – Accurately simulates large
systems with detailed granularity for any object of interest
including, chip, package, PCB, fan or enclosure
- Multi-Stage Analyses – Enables designers to
perform multistage analyses for the design assembly process and
addresses 3D-IC warpage issues for multi-die stacks on a single
package
- True System-Level Thermal Analyses – Combines finite
element method (FEM) with computational fluid dynamics (CFD) for
full-system thermal analysis from chip to package to board and
end-system
- Seamless Integration – Integrated with Cadence’s
implementation platforms, including Virtuoso® Layout Suite,
Allegro® X Design Platform, Innovus™ Implementation System,
Optimality Intelligent System Explorer and AWR Design
Environment®
“Celsius Studio marks a milestone in Cadence’s expanding
presence in the system analysis market by offering the first AI
platform for not only chip, package and PCB thermal analysis, but
also electronics cooling and thermal stress that are critical for
today’s advanced packaging designs, inclusive of chiplets and
3D-ICs,” said Ben Gu, corporate vice president of R&D for
multiphysics system analysis at Cadence. “Seamless integration with
Cadence’s powerful implementation platforms empowers our customers
to perform multiphysics in-design analysis for chips, packages and
boards all the way through to complete systems.”
Customer Endorsements
“Celsius Studio enables Samsung Semiconductor engineers the
ability to gain access to analysis and design insights during the
early stages of the design cycle, simplifying the generation of
precise and rapid thermal simulations for 3D-IC and 2.5D packages.
Our collaboration with Cadence has significantly increased our
product development by 30%, optimizing the package design process
and reducing turnaround time.” WooPoung Kim, Head of Advanced
Packaging, Samsung Device Solutions Research America
“Celsius Studio’s seamless integration with Cadence’s AWR
Microwave Office IC design platform through BAE Systems’ custom GaN
PDK is enabling fast and accurate thermal analysis throughout the
MMIC design cycle, leading to increased first-pass design success
and significantly improved RF and thermal power amplifier
performance.” Michael Litchfield, Technical Director, MMIC Design
at BAE Systems
“Celsius Studio enables our design team to work with detailed
information early in our design cycle so that we can target and
resolve thermal problems before the design is fully committed. With
the reduced turnaround time, the Chipletz engineering team has been
empowered to efficiently run detailed thermal simulations for 3D-IC
and 2.5D packages early and often as we develop these complex
designs.” Jeff Cain, VP of Engineering, Chipletz
Availability
For more information on Celsius Studio, please visit
www.cadence.com/go/cstudiopr. Customers interested in gaining early
access to Celsius Studio should contact their Cadence account
representative.
About Cadence
Cadence is a pivotal leader in electronic systems design,
building upon more than 30 years of computational software
expertise. The company applies its underlying Intelligent System
Design strategy to deliver software, hardware, and IP that turn
design concepts into reality. Cadence customers are the world’s
most innovative companies, delivering extraordinary electronic
products from chips to boards to complete systems for the most
dynamic market applications, including hyperscale computing, 5G
communications, automotive, mobile, aerospace, consumer, industrial
and healthcare. For nine years in a row, Fortune magazine has named
Cadence one of the 100 Best Companies to Work For. Learn more at
cadence.com.
© 2024 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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