Laser Photonics Expands Semiconductor Industry-Focused Product Line
03 Dezembro 2024 - 9:00AM
Business Wire
Laser Photonics Corporation (NASDAQ: LASE) (“LPC” or “the
Company”), a leading global developer of industrial laser systems
for cleaning and other material processing applications, announced
today the expansion of its product offering targeting the surging
market for chip fabrication.
The growing demand for electronics and electric vehicles, the
rise of industrial automation, and the adoption of AI by
technologies across all areas are just some factors that are
propelling the chip design and fabrication market forward. Indeed,
some analysts expect the semiconductor market to reach an annual $1
trillion by 2030 on the global scale. Yet, although global supply
chains have largely recovered from the COVID-19 pandemic,
challenges persist as they struggle to fulfill the high demand for
advanced chips. That is why the adoption of high-speed laser
processing equipment by chip fabs is more essential than ever.
LPC is providing this laser-powered technology to help
accelerate the manufacturing of semiconductors. For the Company,
established as a trusted provider of industrial laser equipment for
surface preparation, cutting, marking, and welding, chip
fabrication has been one of the target sectors. Now, joined by its
recently acquired subsidiary, Control Micro Systems, Inc. (CMS),
LPC has expanded its product line of advanced laser wafer dicing,
marking, and scribing technologies.
One of LPC’s flagship products in this space is the BlackStar
laser wafer dicing and scribing system. Engineered with short-pulse
laser technology, die singulation by the BlackStar involves minimal
heat and does not require water jet cooling to separate brittle
materials like silicon. This technique greatly improves die yield
while minimizing the need for individual die processing, in turn
reducing time and labor.
LPC’s expanded portfolio of products for the semiconductor
industry now also includes custom-tailored multi-station laser
systems for wafer marking, scribing, and lapping, built to handle a
variety of wafer thicknesses and sizes. This innovative technology
features robotic wafer positioning and machine vision, and serves
to facilitate the production and tracing of chips. Separately, a
chip marking system integrating ultraviolet laser technology has
been added to its portfolio, which allows for the production of the
smallest permanent chip markings without damage to the surrounding
microstructure of the die.
“Our growth is fueled by the addition of CMS, and we are excited
to expand our product portfolio and offer high-speed, effective
laser equipment to chip fabs,” said Wayne Tupuola, CEO of LPC. “We
are continuously driven by our mission to upgrade industrial
material processing with reliable laser technology. For the
semiconductor manufacturing sector, where progress is critical
today, we provide automated solutions that greatly optimize the
processing of silicon and related brittle materials.”
For more information, visit the LPC website at
www.laserphotonics.com.
About Laser Photonics Corporation
Laser Photonics is a vertically integrated manufacturer and
R&D Center of Excellence for industrial laser technologies and
systems. Laser Photonics seeks to disrupt the $46 billion,
centuries-old sand and abrasives blasting markets, focusing on
surface cleaning, rust removal, corrosion control, de-painting and
other laser-based industrial applications. Laser Photonics’ new
generation of leading-edge laser blasting technologies and
equipment also addresses the numerous health, safety, environmental
and regulatory issues associated with old methods. As a result,
Laser Photonics has quickly gained a reputation as an industry
leader in industrial laser systems with a brand that stands for
quality, technology and product innovation. Currently,
world-renowned and Fortune 1000 manufacturers in the aerospace,
automotive, defense, energy, maritime, nuclear and space industries
are using Laser Photonics’ “unique-to-industry” systems. For more
information, visit https://www.laserphotonics.com.
Cautionary Note Concerning Forward-Looking Statements
This press release contains “forward-looking statements” (within
the meaning of Section 27A of the Securities Act of 1933, as
amended, and Section 21E of the Securities Exchange Act of 1934, as
amended), including statements regarding the Company’s plans,
prospects, potential results and use of proceeds. These statements
are based on current expectations as of the date of this press
release and involve a number of risks and uncertainties, which may
cause results and uses of proceeds to differ materially from those
indicated by these forward-looking statements. These risks include,
without limitation, those described under the caption “Risk
Factors” in the Registration Statement. Any reader of this press
release is cautioned not to place undue reliance on these
forward-looking statements, which speak only as of the date of this
press release. The Company undertakes no obligation to revise or
update any forward-looking statements to reflect events or
circumstances after the date of this press release except as
required by applicable laws or regulations.
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version on businesswire.com: https://www.businesswire.com/news/home/20241203029095/en/
Media: Karla Kizzort Marketing Specialist Laser Photonics
Corporation kkizzort@laserphotonics.com
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