NXP and TSMC to Deliver Industry’s First Automotive 16 nm FinFET Embedded MRAM
16 Maio 2023 - 4:00AM
NXP Semiconductors (NASDAQ: NXPI), the world leader in automotive
processing, today announced its collaboration with TSMC to deliver
the industry’s first automotive embedded MRAM (Magnetic Random
Access Memory) in 16 nm FinFET technology. As automakers transition
to software-defined vehicles (SDVs), they need to support multiple
generations of software upgrades on a single hardware platform.
Bringing together NXP’s high-performance S32 automotive processors
with fast and highly reliable next-generation non-volatile memory
in 16 nm FinFET technology provides the ideal hardware
platform for this transition.
MRAM can update 20MB of code in ~3 seconds compared to flash
memories that take about 1 minute, minimizing the downtime
associated with software updates and enabling carmakers to
eliminate bottlenecks that arise from long module programming
times. Moreover, MRAM provides a highly reliable technology for
automotive mission profiles by offering up to one million update
cycles, a level of endurance 10x greater than flash and other
emerging memory technologies.
SDVs enable carmakers to roll out new comfort, safety and
convenience features via over-the-air (OTA) updates, extending the
life of the vehicle and enhancing its functionality, appeal, and
profitability. As software-based features become more widespread in
vehicles, the frequency of updates will increase, and MRAM’s speed
and robustness will become even more important.
TSMC’s 16FinFET embedded MRAM technology exceeds the rigorous
requirements of automotive applications with its one-million cycle
endurance, support for solder reflow, and 20-year data retention at
150°C.
“The innovators at NXP have always been quick to recognize the
potential of TSMC’s new process technologies, especially for
demanding automotive applications,” said Dr. Kevin Zhang, Senior
Vice President of Business Development at TSMC. “We’re excited to
see our leading MRAM technology employed in NXP’s S32 platform to
enable the coming generation of software-defined vehicles.”
“NXP’s successful collaboration with TSMC spans decades and has
consistently delivered high quality embedded memory technology to
the automotive market,” said Henri Ardevol, Executive Vice
President and General Manager of Automotive Processing, NXP. “MRAM
is a breakthrough addition to NXP’s S32 automotive solution
portfolio supporting next-generation vehicle architectures.”
AvailabilityTest vehicle samples are complete
and in evaluation. Initial product samples are scheduled for lead
customer availability in early 2025.
About TSMCTSMC pioneered the pure-play foundry
business model when it was founded in 1987, and has been the
world’s largest dedicated semiconductor foundry ever since. The
Company supports a thriving ecosystem of global customers and
partners with the industry’s leading process technologies and
portfolio of design enablement solutions to unleash innovation for
the global semiconductor industry. With global operations spanning
Asia, Europe and North America, TSMC serves as a committed
corporate citizen around the world.
TSMC deployed 272 distinct process technologies, and
manufactured 10,761 products for 499 customers in 2019 by providing
broadest range of advanced, specialty and advanced packaging
technology services. TSMC is the first foundry to provide
automotive grade 16 nm FinFET MRAM production capabilities. The
Company is headquartered in Hsinchu, Taiwan.
About NXP SemiconductorsNXP Semiconductors N.V.
(NASDAQ: NXPI) brings together bright minds to create breakthrough
technologies that make the connected world better, safer and more
secure. As a world leader in secure connectivity solutions for
embedded applications, NXP is pushing boundaries in the automotive,
industrial & IoT, mobile, and communication infrastructure
markets while delivering solutions that advance a more sustainable
future. Built on more than 60 years of combined experience and
expertise, the company has approximately 34,500 team members in
more than 30 countries and posted revenue of $13.21 billion in
2022. Find out more at www.nxp.com.
NXP and the NXP logo are trademarks of NXP B.V. All other
product or service names are the property of their respective
owners. All rights reserved. © 2023 NXP B.V.
For more information, please contact:
Americas & Europe |
|
Greater China / Asia |
Andrea Lempart |
|
Ming Yue |
Tel: +49 175 610 695 1 |
|
Tel: +86 21 2205 2690 |
Email: andrea.lempart@nxp.com |
|
Email: ming.yue@nxp.com |
NXP-CorpNXP-Auto
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/f3ec70ea-3f84-4f0b-a135-dc8e68b20347
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