5G Radios Shrink With NXP’s New Top-Side Cooling For RF Power
06 Junho 2023 - 4:00AM
NXP Semiconductors (NASDAQ: NXPI) announced today a family of
top-side cooled RF amplifier modules, based on a packaging
innovation designed to enable thinner and lighter radios for 5G
infrastructure. These smaller base stations can be more easily and
cost-effectively installed, and blend more discretely into their
environment. NXP’s GaN multi-chip module series, combined with the
industry’s first top-side cooling solution for RF power, helps to
reduce not only the thickness and weight of the radio by more than
20 percent, but also the carbon footprint for the manufacture and
deployment of 5G base stations.
“Top-side cooling represents a significant opportunity for the
wireless infrastructure industry, combining high power capabilities
with advanced thermal performance to enable a smaller RF
subsystem,” said Pierre Piel, Vice President and General Manager
for Radio Power at NXP. “This innovation delivers a solution for
the deployment of more environmentally friendly base stations,
while also enabling the network density needed to realize the full
performance benefits of 5G.”
NXP’s new top-side cooled devices deliver significant design and
manufacturing benefits, including the removal of the dedicated RF
shield, use of cost-effective and streamlined printed circuit
board, and separation of thermal management from RF design. These
features help networking solution providers create slimmer and
lighter 5G radios for mobile network operators, while reducing
their overall design cycle.
NXP’s first top-side cooled RF power module series is designed
for 32T32R, 200 W radios covering 3.3 GHz to 3.8 GHz. The devices
combine the company’s in-house LDMOS and GaN semiconductor
technologies to enable high gain and efficiency with wideband
performance, delivering 31 dB gain and 46 percent efficiency over
400 MHz of instantaneous bandwidth.
The A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC products are
available today. The A5M36TG140-TC will be supported by NXP’s
RapidRF reference board series. For more information, see our fact
sheet at NXP.com/TSCEVBFS or contact NXP Sales worldwide.
About NXP SemiconductorsNXP Semiconductors N.V.
(NASDAQ: NXPI) brings together bright minds to create breakthrough
technologies that make the connected world better, safer and more
secure. As a world leader in secure connectivity solutions for
embedded applications, NXP is pushing boundaries in the automotive,
industrial & IoT, mobile, and communication infrastructure
markets while delivering solutions that advance a more sustainable
future. Built on more than 60 years of combined experience and
expertise, the company has approximately 34,500 team members in
more than 30 countries and posted revenue of $13.21 billion in
2022. Find out more at www.nxp.com.
NXP and the NXP logo are trademarks of NXP B.V. All other
product or service names are the property of their respective
owners. All rights reserved. © 2023 NXP
B.V. For more information, please
contact:
Americas & Europe |
|
Greater China / Asia |
Phoebe Francis |
|
Ming Yue |
Tel: +1 737-274-8177 |
|
Tel: +86 21 2205 2690 |
Email: phoebe.francis@nxp.com |
|
Email: ming.yue@nxp.com |
|
|
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A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/c2f68a07-3934-49f8-a921-3c28985fcf63
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