Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering
26 Novembro 2024 - 8:00AM
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merit addressing the evolving needs for next-generation datacom
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MIGDAL HAEMEK, Israel, November 26,
2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading
foundry of high-value analog semiconductor solutions, today
announced the release of its new 300mm Silicon Photonics (SiPho)
process as a standard foundry offering. This advanced process
complements Tower's well-established 200mm (PH18) platform that is
in high-volume production today, providing its customers with a
cutting-edge solution tailored to meet the growing needs of
high-speed data communications for next generation datacom
applications.
The unique 300mm offering features best-in-class
silicon waveguides and the most advanced low-loss silicon nitride
waveguide offerings in the industry. The larger wafer size enhances
compatibility with industry-standard OSAT (Outsourced Semiconductor
Assembly and Test) platforms, facilitating seamless integration
with electronic components and improving overall efficiency.
"We are proud to introduce our new, highly
advanced Silicon Photonics offering, which provides a seamless path
for our existing customers to transition to next-generation
technology on 300mm wafers,” said Dr. Edward Preisler, Vice
President and General Manager of RF Business Unit. “This
process builds on Tower’s industry-leading 200mm SiPho platform
both in terms of continuous process enhancements and increasing
flexibility of supply for our customers."
For additional information on Tower’s RF &
HPA technology platform, please visit here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM),
the leading foundry of high-value analog semiconductor solutions,
provides technology, development, and process platforms for its
customers in growing markets such as consumer, industrial,
automotive, mobile, infrastructure, medical and aerospace and
defense. Tower Semiconductor focuses on creating a positive and
sustainable impact on the world through long-term partnerships and
its advanced and innovative analog technology offering, comprised
of a broad range of customizable process platforms such as SiGe,
BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging
sensors, displays, integrated power management (BCD and 700V),
photonics, and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
process transfer services including development, transfer, and
optimization, to IDMs and fabless companies. To provide multi-fab
sourcing and extended capacity for its customers, Tower
Semiconductor owns two facilities in Israel (150mm and 200mm), two
in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns
through its 51% holdings in TPSCo, shares a 300mm facility in
Agrate, Italy, with ST as well as has access to a 300mm capacity
corridor in Intel’s New Mexico factory. For more information,
please visit: www.towersemi.com.
Safe Harbor Regarding Forward-Looking
Statements
This press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F and 6-K, as
were filed with the Securities and Exchange Commission (the “SEC”)
and the Israel Securities Authority. Tower does not intend to
update, and expressly disclaim any obligation to update, the
information contained in this release.
Tower Semiconductor Investor Relations
Contact: Noit Levy | +972-4-604-7066 |
noitle@towersemi.comTower Semiconductor Company
Contact: Orit Shahar | +972-74-7377440 |
oritsha@towersemi.com
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