- CEVA-XC22 DSP named Best IP/Processor of the
Year
- Highly scalable architecture designed for 5G-Advanced
mobile broadband, smartphones and cellular RAN equipment
ROCKVILLE, Md., Dec. 7, 2023
/PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), today announced that it
has won the Best IP/ Processor of the Year award at the prestigious
EE Awards Asia event, recently hosted in Taipei.
The award-winning CEVA-XC22 DSP is based on a
groundbreaking vector multi-threaded massive compute technology
designed to address next-generation 5G-Advanced workloads across a
broad spectrum of use cases, including smartphones, high-end
Enhanced Mobile Broadband (eMBB) devices (e.g. Fixed Wireless
Access and Industrial Terminals) and a range of cellular
communications infrastructure devices (e.g. 5G satellites, base
stations, virtualized DU accelerators, and beamforming compute in
Massive MIMO radios).
"Ceva is proud to receive this recognition for CEVA-XC22, the
world's most advanced vector baseband processor," said Guy Keshet, Vice President and General Manager
of the Mobile Broadband Business Unit at Ceva. "This prestigious
award reflects the vital role our industry-leading DSPs play in
powering the most demanding 5G-advanced workloads, from endpoints
to infrastructure, enabling the development of more
energy-efficient products that in turn have a direct positive
impact on the environment and society."
The EE Awards Asia celebrate the best products, companies, and
individuals across the continent's highly regarded electronics
industry. Judging and selection is undertaken by a global panel of
experts, who select the shortlist before the EETimes reader
communities of EE Times and EDN in Taiwan and Asia cast their votes.
The CEVA-XC22 supports two execution threads by employing a
novel Dynamic Vector Threading (DVT) scheme, which supports true
hardware multi-threading, which up until now was only found in
general purpose CPU architectures. It offers a 2.5X improvement in
efficiency (performance per watt and area) for essential 5G use
cases and computation kernels versus its predecessor. The CEVA-XC22
will also be integrated within the PentaG-RAN platform for cellular
infrastructure and PentaG2-Max platform for high performance mobile
devices, wherein it will power CEVA's heterogeneous compute
platforms, including both DSPs and compute engine accelerators. For
more information, visit
https://www.ceva-dsp.com/product/ceva-xc22/.
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of
innovation to the smart edge. Our wireless communications, sensing
and Edge AI technologies are at the heart of some of today's most
advanced smart edge products. From Bluetooth connectivity, Wi-Fi,
UWB and 5G platform IP for ubiquitous, robust communications, to
scalable Edge AI NPU IPs, sensor
fusion processors and embedded application software that make
devices smarter, we have the broadest portfolio of IP to connect,
sense and infer data more reliably and efficiently. We deliver
differentiated solutions that combine outstanding performance at
ultra-low power within a very small silicon footprint. Our goal is
simple – to deliver the silicon and software IP to enable a
smarter, safer, and more interconnected world. This philosophy is
in practice today, with Ceva powering more than 17 billion of the
world's most innovative smart edge products from AI-infused
smartwatches, IoT devices and wearables to autonomous vehicles and
5G mobile networks.
Our headquarters are in Rockville,
Maryland with a global customer base supported by operations
worldwide. Our employees are among the leading experts in their
areas of specialty, consistently solving the most complex design
challenges, enabling our customers to bring innovative smart edge
products to market.
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X,
YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.