Aehr Receives $13.7 Million in Follow-on Orders for FOX WaferPak™ Contactors for Volume Production Burn-in Test and Stabilization of Silicon Carbide MOSFETs for Electric Vehicles
09 Junho 2023 - 8:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and production
burn-in equipment, today announced it has received $13.7
million in orders from its lead silicon carbide test and burn-in
customer for WaferPak™ full wafer Contactors to meet their
increased production capacity needs for silicon carbide power
semiconductors for the electric vehicle market. This customer is a
leading Fortune 500 supplier of semiconductor devices with a
significant customer base in the automotive semiconductor market.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We continue to be excited about this customer’s
incredible growth and production ramp to meet capacity increases
from their current customers, as well as to meet new design wins
using our wafer level test and burn-in systems and WaferPaks. These
orders for a large number of WaferPaks include both current design
capacity increases and several new designs that are expected to
ramp to volume production after their customer qualification is
completed. These WaferPaks are scheduled to be delivered over the
next six months.
“This customer has a significant installed base of our
FOX-XP™ wafer level test and burn-in systems that is growing
as we continue to ship systems to them monthly. Each of the 18
wafer FOX-XP systems requires 18 WaferPaks that each make contact
with 100% of the die on the wafers with parametric measurement and
monitoring that allows us to provide 100% traceability of test
coverage and results to them on every die on every wafer. This is
incredibly important to them, as well as other companies that
supply devices to mission critical applications such as the
traction inverters used to power electric vehicle motors.
“As we have noted in the past, FOX-XP system orders are required
to increase general manufacturing capacity, while our proprietary
WaferPak Contactors are unique to each device design. As our
customers win new designs from their customers, Aehr secures orders
for new WaferPak Contactors to fulfill these new wins. Over time,
we expect to see our follow-on WaferPak business grow both in
absolute dollars and as a percent of our overall revenue.
“These WaferPak full wafer Contactors are also shipping in a
configuration that utilizes new patented features that allow
optimized alignment accuracy and alignment speed and throughput
using our new fully automated FOX WaferPak Aligners that began
shipping this last month. The new FOX WaferPak Aligner comes in
both stand-alone and integrated configurations. In a stand-alone
configuration, each FOX WaferPak Aligner can service multiple
18-wafer FOX-XPs in batch mode, while the integrated configuration
of our Aligner docks directly to the front of the 18-wafer FOX-XP
system and allows continuous flow of WaferPak alignment and testing
in the FOX-XP without the need for any operator handling. The
integrated FOX-XP and WaferPak Aligner allow the ability to support
a lights-out operation with full factory automation using automated
mobile robot transport or full overhead material movement of wafer
transport cases (SMIF pods or FOUPs) carrying 150mm, 200mm, or
300mm wafers.”
The FOX-XP system, available with multiple WaferPak Contactors
(full wafer test) or multiple DiePakTM Carriers (singulated
die/module test) configurations, is capable of functional test and
burn-in/cycling of integrated devices such as silicon carbide (SiC)
power devices, silicon photonics as well as other optical devices,
2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic
sensors, microcontrollers, and other leading-edge ICs in either
wafer form factor, before they are assembled into single or
multi-die stacked packages, or in singulated die or module form
factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the ABTSTM and
FOX-PTM families of test and burn-in systems and FOX WaferPakTM
Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge silicon carbide-based
power semiconductors, memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The FOX-CP system is a new low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices and the newest addition to the
FOX-P product family. The WaferPak Contactor contains a unique full
wafer probe card capable of testing wafers up to 300mm that enables
IC manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPakTM and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts:
Aehr
Test Systems |
MKR
Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
EVP of Sales & Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(323) 468-2300 |
vrogers@aehr.com |
aehr@mkr-group.com |
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