Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
06 Dezembro 2023 - 10:00AM
The E-Mobility, sustainability and data center markets require
products that are conducive to high-volume manufacturing. To better
automate the installation process, Press-Fit terminals are often
used because they offer a solder-free solution to mount power
modules to the PCB. Microchip Technology
(Nasdaq:
MCHP) today announces its expansive portfolio of SP1F and
SP3F power modules are now available with
Press-Fit
terminals for high-volume applications.
Solder-free Press-Fit power module terminals allow for automated
or robotic installation, which simplifies and speeds up the
assembly process to reduce manufacturing costs. The high accuracy
of the terminal locations and the novel Press-Fit pin design in the
SP1F and SP3F power modules enables high-reliability contact with
the printed circuit card. Overall, a Press-Fit power module
solution can save valuable time and production costs.
There are over 200 variants available in Microchip’s SP1F and
SP3F power modules portfolio, with options to use mSiC™ technology
or Si semiconductors and an array of topologies and ratings. The
SP1F and SP3F are offered in voltage range of 600V-1700V and up to
280A.
With Press-Fit technology, the power module pins are not
soldered to the PCB. Instead, the electrical connection is made by
pressing the pins into properly sized PCB holes. A key advantage of
a Press-Fit power module solution is it eliminates the need for
wave soldering. This is especially important when the PCB is made
to also include Surface-Mount Technology (SMT) components.
“Our power modules with Press-Fit terminals offer customers the
flexibility to fully customize their design and are cost-effective
power solutions for high-volume production,” said Leon Gross, vice
president of Microchip’s discrete products group. “This type of
plug-and-play power solution also provides a highly reliable
mounting solution for automated or robotic assembly.”
The highly configurable SP1F and SP3F power modules are fully
compliant with the Restriction of Hazardous Substances Directive
(RoHS).
Support and Resources
Application note AN4322 provides detailed
mounting instructions for SP1F and SP3F Press-Fit power
modules.
Pricing and Availability
The Press-Fit terminal option with Microchip’s SP1F and SP3F
power modules is now available. For additional information and to
purchase, contact a Microchip sales representative, authorized
worldwide distributor or visit Microchip’s Purchasing and Client
Services website, www.microchipdirect.com.
Resources
High-res images available through Flickr or editorial contact
(feel free to publish):
- Application image:
www.flickr.com/photos/microchiptechnology/53334254890/sizes/l
About Microchip
Technology:Microchip Technology Inc. is a
leading provider of smart, connected and secure embedded control
solutions. Its easy-to-use development tools and comprehensive
product portfolio enable customers to create optimal designs which
reduce risk while lowering total system cost and time to market.
The company’s solutions serve more than 125,000 customers across
the industrial, automotive, consumer, aerospace and defense,
communications and computing markets. Headquartered in Chandler,
Arizona, Microchip offers outstanding technical support along with
dependable delivery and quality. For more information, visit the
Microchip website at www.microchip.com.
Note: The Microchip name and logo, the Microchip logo are
registered trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries. mSiC is a trademark of Microchip
Technology Inc. in the U.S.A. and other countries. All other
trademarks mentioned herein are the property of their respective
companies.
Editorial Contact: |
Reader Inquiries: |
Kim Dutton |
1-888-624-7435 |
480-792-4386 |
|
kim.dutton@microchip.com |
|
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