Addressing the growing Chinese and global
market needs for advanced AR/VR solutions
Based on Tower’s high yield, dedicated
process for micro display backplane, supporting current-driven OLED
pixel designs
MIGDAL HAEMEK, Israel, and HANGZHOU,
China, February 26, 2024 – Tower Semiconductor
(NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor
foundry solutions, and Tianyi Micro, a leading provider of micro
display driver chips specializing in developing silicon-based
micro-OLEDs and micro-LEDs, today announced their strategic
cooperation in the development of next-generation OLED micro
displays for AR/VR, addressing the growing Chinese and global
market needs for advanced AR/VR solutions. The development is based
on Tower’s unique 180nm and 65nm dedicated micro display backplane
process flows, supporting current-driven (as opposed to
voltage-driven) OLED pixel designs. According to market analysis by
Omdia, the micro display market will grow from 24 million units in
2023 to almost 90 million units in 2028, a CAGR of 67%. The overall
AR/VR market, dominated by VR and XR headsets already reached $1.15
billion in 2023.
Tianyi Micro is currently the sole provider in
China of current-driven pixel designs and selected Tower as its key
foundry partner for micro display backplane developments. As
performance requirements call for specific device characteristics
such as high yield, ultra-low leakage combined with high voltage
for high brightness, Tower has developed dedicated process flows
addressing these requirements. Having such dedicated flows enables
Tianyi to pursue its leading market position with next-generation
micro displays.
"We chose Tower for its well-known continuous
innovation in silicon-based OLED technology, including but not
limited to ultra-low leakage MOS devices, and customized anode for
compact pixel circuit design. These advanced offerings, along with
our close collaboration, allow Tianyi Micro to achieve high display
performance based on current-driven pixel circuits/products,” said
Lina Sun, Tianyi CEO. “Tower’s professional support and expertise
allow us to achieve first-pass silicon success that meet the high
requirements of microdisplay products”.
Tower’s platform offers several strategic
advantages such as high resolution, high brightness, excellent
yield, and display uniformity. It’s dedicated flows for display
backplanes include custom low leakage devices, high voltage (up to
10V) pixels for high brightness displays, and in-pixel MIM
capacitors, as well as tailor-made back end for customer-specific
requirements (customized anodes, protective layers, custom CMP).
These flows include complete process/device offerings, silicon
results and PDK support with very accurate modeling. They are
available in full flow or lean flow for high yield 2-chip
solutions.
“We value long-term cooperations that yield
progress and technological advancements. Our collaboration with
Tianyi Micro in micro display technology development is a perfect
example for such a process, which extended our offering to include
dedicated flows for micro display application”, said Dr. Avi Strum,
Senior Vice President and CTO, Tower Semiconductor. “Like CMOS
Image Sensors before, OLED Micro-displays have reached a point
where standard CMOS flows are not meeting the image quality
requirements. Future Displays call for a dedicated flow with
customized devices for yield and performance. With projects that
began on our 180nm and continued to 65nm high voltage platform for
next-generation micro displays, we are proud to continue our
collaboration and drive solutions that deliver mutual success”.
Tower will be presenting this exciting
technology and recent relevant developments in upcoming SEMICON
China on March 20, 2024, at 11:30 am: Advanced CMOS Process
Technology for Micro Display Manufacturing by Dr. Benoit
Dupont, Sensors and Display Marketing Director, Tower
Semiconductor.
For additional information about Tower
Semiconductor’s micro displays technology offerings, please visit
here.
For additional information about Tower
Semiconductor’s CMOS image sensors technology offerings, please
visit here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM),
the leading foundry of high-value analog semiconductor solutions,
provides technology, development, and process platforms for
integrated circuits (ICs) in growing markets such as consumer,
industrial, automotive, mobile, infrastructure, medical and
aerospace and defense. Tower Semiconductor focuses on creating a
positive and sustainable impact on the world through long-term
partnerships and its advanced and innovative analog technology
offering, comprised of a broad range of customizable process
platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS
image sensor, non-imaging sensors, displays, integrated power
management (BCD and 700V), photonics, and MEMS. Tower Semiconductor
also provides world-class design enablement for a quick and
accurate design cycle as well as process transfer services
including development, transfer, and optimization, to IDMs and
fabless companies. To provide multi-fab sourcing and extended
capacity for its customers, Tower Semiconductor owns two facilities
in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan
(200mm and 300mm) which it owns through its 51% holdings in TPSCo,
a 300mm facility in Agrate, Italy, shared with ST as well as a
300mm capacity corridor in Intel’s New Mexico factory. For more
information, please visit: www.towersemi.com.
About Tianyi MicroTianyi Micro is incorporated
in Beijing, China in 2020, and has set up teams in Beijing,
Hangzhou, and Shenzhen to better serve their customers. Tianyi
Micro is dedicated to the design of MicroOLED/MicroLED driver IC,
whose products are primarily utilized in AR, VR, and MR spatial
computing devices. Since 2020, Tianyi Micro has successfully
mass-produced several sizes of MicroOLED display driver ICs which
feature long lifespans, ultra-low power consumption and amazing
display performance. Currently, Tianyi Micro has been developing
TY130 in full swing - a 1.3-inch MicroOLED backplane for spatial
computing equipment. The TY130 is expected to be launched in April
2024.
Safe Harbor Regarding Forward-Looking
Statements This press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority. Tower does not intend
to update, and expressly disclaim any obligation to update, the
information contained in this release.
Tower Semiconductor Company
Contact: Orit Shahar | +972-74-7377440 |
oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact:
Noit Levy | +972-4-604-7066 | noitle@towersemi.com
- Tianyi OLED MicroDisplay PR Final
Tower Semiconductor (NASDAQ:TSEM)
Gráfico Histórico do Ativo
De Out 2024 até Nov 2024
Tower Semiconductor (NASDAQ:TSEM)
Gráfico Histórico do Ativo
De Nov 2023 até Nov 2024
