To Further Extend Advanced Packaging
Technology and Solutions
SINGAPORE, Aug. 8, 2023
/PRNewswire/
-- Kulicke and Soffa Industries, Inc. (NASDAQ:
KLIC) ("Kulicke & Soffa", "K&S", "we" or the
"Company") announced its expanded collaboration with The
University of California, Los Angeles,
Center for Heterogeneous Integration and Performance Scaling (UCLA
CHIPS) to deliver cost-effective advanced solutions which are
needed within Artificial Intelligence (AI), high-performance
computing (HPC) and data-center applications today. As the need for
leading-edge packaging technology moves into higher-volume markets,
yield, throughput and productivity are becoming increasingly
important.
K&S joined UCLA CHIPS as a charter member in 2016 to develop
ultrafine pitch micro-bump interconnect solutions. Shortly after,
thermocompression bonding (TCB) at 30µm micro-bump pitch became
feasible. By leveraging formic acid treatment, K&S has
demonstrated 10µm pitch capability in TCB. As heterogeneous chiplet
packaging opportunities expand into higher-volume markets, K&S
innovations have enhanced development engagements with key
commercial customers, capable of enabling this broad and long-term
industry transition.
Kulicke & Soffa's innovative fluxless process eliminates
contamination concerns while ensuring interconnect integrity
through an integrated delivery platform. The Company's
high-accuracy, production-proven TCB portfolio is capable of
supporting the majority of interposer-based, and 3D heterogeneous
integration applications in the market today. K&S and
UCLA's ongoing collaboration seeks to
further develop manufacturable Cu-to-Cu solutions capable of
sub-5µm pitch. The advantage of this TCB approach is that it is
independent of dielectric specifics, and meets mil spec shear
force, temperature cycling and moisture ingress standards.
"Capable advanced packaging solutions are critically necessary
to overcome well-known node-shrink challenges and extend
package-level transistor density. We continue to push the
boundaries of technology and deliver high accuracy,
high-throughput, and high-yield solutions which will accelerate the
broader industry's transition to heterogeneous integration. We look
forward to sustaining our leadership and technical progress as we
continue broadening our advanced packaging solutions," said
Bob Chylak, Kulicke & Soffa's
Senior Vice President and Chief Technology Officer.
AI, HPC and data center processors are transitioning to
interposer and 3D heterogeneous approaches due to the rising design
costs and yield challenges with the mature monolithic process.
According to Yole Group, a market research & strategy
consulting company, the 2.5D and 3D packaging volume is expected to
grow at about 15% CAGR, reaching over 10 billion units in 2028.
In addition to the heterogeneous transition, TCB is a pervasive
technology and is already utilized in a growing set of
semiconductor devices such as application processors, silicon
photonics (SiPh), CMOS image sensors, high bandwidth memory (HBM),
processor-memory integration, and logic-memory integration,
providing many long-term opportunities for K&S micro-bump
interconnect solutions. Through close engagements with
industry-leading fabless, foundry, IDM and OSAT customers, K&S
is providing advanced packaging solutions which directly support
this significant industry transition.
"It has been a great journey driving innovation to this very
capable process over the past seven years," said Subramanian S. Iyer, Professor and Director of
UCLA CHIPS housed in the UCLA Samueli School of Engineering. "While
existing TCB technology extends beyond today's uses, we are excited
to further extend our collaboration with K&S and achieve the
next milestone of below 5µm pitch. We look forward to enabling
future generations of devices by scaling performance with advanced
packaging."
Chan Pin Chong, K&S's
Executive Vice President, Products and Solutions said, "As the
semiconductor industry aggressively pursues more complex assembly
and packaging approaches, TCB continues to be a leading micro-bump
solution for fine-pitch and Cu-to-Cu interconnect processes. With
the majority of high-volume applications at 35µm pitch today, our
demonstrated 10µm fluxless TCB capability is well positioned to
support the emerging needs of heterogeneous applications of
tomorrow. With our collaboration and continuous development efforts
with UCLA, we are confident that
K&S micro-bump interconnect solutions will deliver exceptional
value to support the rapidly evolving industry."
About Kulicke & Soffa
Founded in 1951, Kulicke and Soffa Industries, Inc. specializes
in developing cutting-edge semiconductor and electronics assembly
solutions enabling a smarter and more sustainable future. Our
ever-growing range of products and services supports growth and
facilitates technology transitions across large-scale markets, such
as advanced display, automotive, communications, compute, consumer,
data storage, energy storage and industrial.
Cautionary Statement Regarding Forward-Looking
Statements
This press release contains statements relating to future events
and our future results. These statements are "forward-looking"
statements within the meaning of the Private Securities Litigation
Reform Act of 1995. These statements include, but are not limited
to, statements regarding the market for thermocompression bonding
solutions and the performance and competitiveness of our particular
solutions. While these forward-looking statements represent
our judgments and future expectations concerning our business, a
number of risks, uncertainties and other important factors could
cause actual developments and results to differ materially from our
expectations. These factors include, but are not limited to, the
execution and effect of our business strategy, future business
decisions made by us and our competitors, the effects of
macroeconomic headwinds on our business and industry, and the other
factors listed or discussed in our Annual Report on Form 10-K for
the fiscal year ended October 1,
2022, filed on November 17,
2022, and our other filings with the Securities and Exchange
Commission. Kulicke and Soffa Industries, Inc. is under no
obligation to (and expressly disclaims any obligation to) update or
alter its forward-looking statements whether as a result of new
information, future events or otherwise.
About the UCLA Center for Heterogeneous Integration and
Performance Scaling
Established in 2015 at the UCLA Samueli School of Engineering,
the UCLA Center for Heterogeneous Integration and Performance
Scaling (UCLA CHIPS) aims to address the dramatic changes taking
place in the electronic hardware arena. UCLA CHIPS is an
interdisciplinary university-led consortium composed of industrial
partners and consortia, universities and government agencies.
Contacts Kulicke & Soffa
Marilyn Sim
Public Relations
+65-68809309
msim@kns.com
Kulicke & Soffa
Joseph
Elgindy
Finance +1-215-784-7500
investor@kns.com
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SOURCE Kulicke & Soffa Industries, Inc.