Awards Recognize Synopsys' Significant
Contribution to Driving Advanced-Node Silicon Success and
Technology Innovation Leadership
Highlights:
- Certification of new Synopsys digital and analog design flows
delivers proven power, performance, and area results for TSMC N2
and N3P processes.
- Silicon success of Synopsys Interface IP portfolio on TSMC N3E
reduces integration risk, accelerates time-to-market, and provides
a fast path to TSMC N3P.
- Comprehensive multi-die system solution integrated with 3Dblox
2.0 standard boosts productivity for fast heterogeneous
integration.
- Radio frequency design reference flow on TSMC N4P developed in
collaboration with Ansys and Keysight delivers superior performance
and power with an interoperable, front-to-back design flow.
SUNNYVALE, Calif., Oct. 26, 2023 /PRNewswire/
-- Synopsys, Inc. (Nasdaq: SNPS) has been selected as a TSMC
Open Innovation Platform® (OIP) Partner of the Year, earning five
awards spanning digital, analog, multi-die system, radio frequency
(RF) design, and interface IP. The long-standing collaboration
between the two companies continues to deliver production-proven
solutions, including certified design flows, powered by the
Synopsys.ai™ full-stack AI-driven EDA suite, that help mutual
customers accelerate the development and silicon success of
innovative AI, automotive, and high-performance computing designs.
Synopsys solutions were featured in an unprecedented number of
presentations at the 2023 North America TSMC OIP Ecosystem forum,
highlighting strong collaboration with TSMC and partners on proven
solutions for TSMC's advanced process and
3DFabric™ technologies.
"TSMC and Synopsys are making huge leaps to provide engineering
teams with innovative solutions to successfully develop complex
designs on the latest advanced process nodes," said Dan
Kochpatcharin, head of Design Infrastructure Management Division at
TSMC. "The partner awards recognize the significant contributions
made by the TSMC OIP ecosystem partners like Synopsys to advance
the next generation of high-performance designs on TSMC's
technologies, with massively improved quality of results and time
to results."
"Being recognized by TSMC underscores Synopsys' commitment to
providing the industry with leading solutions including
Synopsys.ai, a full-stack AI-driven EDA suite, and silicon-proven
IP solutions that help chipmakers bring differentiated products to
market faster," said Sanjay Bali,
vice president of Strategy and Product Management for the EDA Group
at Synopsys. "Our longstanding collaboration with TSMC continues to
deliver new EDA and IP innovations that enable the
semiconductor industry to efficiently transition to 2nm and
multi-die systems, while also facilitating AI-based analog design
migration. These significant technology advancements help our
customers meet and beat their design and productivity targets."
Over the past year, the companies' collaboration has yielded
impactful design solutions for mutual customers, garnering five
awards including:
- Development of 2nm and N3P Design Infrastructure:
Synopsys' production-proven digital and analog design flows
certified on TSMC N2 and N3P process technology enhance the quality
of results for high-performance computing, mobile, and AI
designs.
- Interface IP: Synopsys' broad, silicon-proven interface
IP portfolio on the TSMC N3E process, with a fast path to the N3P
process, provides a competitive edge for chipmakers looking to
reduce integration risk and accelerate time to first-pass silicon
success.
- Development of mmWave Design Solutions: Synopsys RF
reference design flow, developed in collaboration with Ansys and
Keysight, provides an open, front-to-back design flow with
performance, power, and productivity benefits.
- Development of 3Dblox Design Prototyping Solution:
Synopsys's comprehensive Multi-Die System solution combined with
3Dblox standard enables early architecture exploration and
feasibility analysis, efficient die/package co-design, robust
die-to-die connectivity, and improved manufacturing and
reliability.
- Partner Collaboration: Synopsys, Ansys, and Keysight
were recognized for their unprecedented collaboration to develop
the RF reference flows for TSMC's leading N16, N6 and N4P
processes.
Additional Resources
- News Release: Synopsys and TSMC Collaborate to Accelerate
2nm Innovation for Advanced SoC Design with Certified Digital and
Analog Design Flows
- News Release: Synopsys and TSMC Advance Analog Design
Migration with Reference Flow Across Advanced TSMC Processes
- News Release: Synopsys Unveils Industry's Broadest
Portfolio of Automotive-Grade IP on TSMC's N5A Process
Technology
- News Release: Synopsys and TSMC Streamline Multi-Die
System Complexity with Unified Exploration-to-Signoff Platform and
Proven UCIe IP on TSMC N3E Process
- News Release: Keysight, Synopsys, and Ansys Accelerate
RFIC Semiconductor Design with New Reference Flow for TSMC's
Advanced 4nm RF FinFET Process
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner
for innovative companies developing the electronic products and
software applications we rely on every day. As an S&P 500
company, Synopsys has a long history of being a global leader in
electronic design automation (EDA) and semiconductor IP and offers
the industry's broadest portfolio of application security testing
tools and services. Whether you're a system-on-chip (SoC) designer
creating advanced semiconductors, or a software developer writing
more secure, high-quality code, Synopsys has the solutions needed
to deliver innovative products. Learn more at
www.synopsys.com.
Editorial Contact:
Kelli Wheeler
Synopsys, Inc.
(518) 248-0780
kelliw@synopsys.com
corp-pr@synopsys.com
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SOURCE Synopsys, Inc.