New IBM Telum II Processor and IBM Spyre
Accelerator unlock capabilities for enterprise-scale AI, including
large language models and generative AI
Advanced I/O technology enables and simplifies
a scalable I/O sub-system designed to reduce energy consumption and
data center footprint
PALO ALTO, Calif., Aug. 26, 2024 /PRNewswire/ -- IBM (NYSE: IBM)
revealed architecture details for the upcoming IBM Telum® II
Processor and IBM Spyre™ Accelerator at Hot Chips 2024. The new
technologies are designed to significantly scale processing
capacity across next generation IBM Z mainframe systems helping
accelerate the use of traditional AI models and Large Language AI
models in tandem through a new ensemble method of AI.
With many generative AI projects leveraging Large Language
Models (LLMs) moving from proof-of-concept to production, the
demands for power-efficient, secured and scalable solutions have
emerged as key priorities. Morgan Stanley research published in
August projects generative AI's power demands will skyrocket 75%
annually over the next several years, putting it on track to
consume as much energy in 2026 as Spain did in 2022.1 Many IBM
clients indicate architectural decisions to support appropriately
sized foundation models and hybrid-by-design approaches for AI
workloads are increasingly important.
The key innovations unveiled today include:
- IBM Telum II Processor: Designed to power
next-generation IBM Z systems, the new IBM chip features increased
frequency, memory capacity, a 40 percent growth in cache and
integrated AI accelerator core as well as a coherently attached
Data Processing Unit (DPU) versus the first generation Telum chip.
The new processor is expected to support enterprise compute
solutions for LLMs, servicing the industry's complex transaction
needs.
- IO acceleration unit: A completely new Data Processing
Unit (DPU) on the Telum II processor chip is engineered to
accelerate complex IO protocols for networking and storage on the
mainframe. The DPU simplifies system operations and can improve key
component performance.
- IBM Spyre Accelerator: Provides additional AI
compute capability to complement the Telum II processor. Working
together, the Telum II and Spyre chips form a scalable architecture
to support ensemble methods of AI modeling – the practice of
combining multiple machine learning or deep learning AI models with
encoder LLMs. By leveraging the strengths of each model
architecture, ensemble AI may provide more accurate and robust
results compared to individual models. The IBM Spyre Accelerator
chip, previewed at the Hot Chips 2024 conference, will be delivered
as an add on option. Each accelerator chip is attached via a
75-watt PCIe adapter and is based on technology developed in
collaboration with the IBM Research. As with other PCIe cards, the
Spyre Accelerator is scalable to fit client needs.
"Our robust, multi-generation roadmap positions us to remain
ahead of the curve on technology trends, including escalating
demands of AI," said Tina Tarquinio,
VP, Product Management, IBM Z and LinuxONE. "The Telum II Processor
and Spyre Accelerator are designed to deliver high-performance,
secured, and more power efficient enterprise computing solutions.
After years in development, these innovations will be introduced in
our next generation IBM Z platform so clients can leverage LLMs and
generative AI at scale."
The Telum II processor and the IBM Spyre Accelerator will be
manufactured by IBM's long-standing fabrication partner, Samsung
Foundry, and built on its high performance, power efficient 5nm
process node. Working in concert, they will support a range of
advanced AI-driven use cases designed to unlock business value and
create new competitive advantages. With ensemble methods of AI,
clients can achieve faster, more accurate results on their
predictions. The combined processing power announced today will
provide an on ramp for the application of generative AI use cases.
Some examples could include:
- Insurance Claims Fraud Detection: Enhanced fraud
detection in home insurance claims through ensemble AI, which
combine LLMs with traditional neural networks geared for improved
performance and accuracy.
- Advanced Anti-Money Laundering: Advanced detection for
suspicious financial activities, supporting compliance with
regulatory requirements and mitigating the risk of financial
crimes.
- AI Assistants: Driving the acceleration of
application lifecycle, transfer of knowledge and expertise, code
explanation as well as transformation, and more.
Specifications and Performance Metrics:
Telum II processor: Featuring eight high-performance
cores running at 5.5GHz, with 36MB L2 cache per core and a 40%
increase in on-chip cache capacity for a total of 360MB. The
virtual level-4 cache of 2.88GB per processor drawer provides a 40%
increase over the previous generation. The integrated AI
accelerator allows for low-latency, high-throughput in-transaction
AI inferencing, for example enhancing fraud detection during
financial transactions, and provides a fourfold increase in compute
capacity per chip over the previous generation.
The new I/O Acceleration Unit DPU is integrated into the Telum
II chip. It is designed to improve data handling with a 50%
increased I/O density. This advancement enhances the overall
efficiency and scalability of IBM Z, making it well suited to
handle the large-scale AI workloads and data-intensive applications
of today's businesses.
Spyre Accelerator: A purpose-built enterprise-grade
accelerator offering scalable capabilities for complex AI models
and generative AI use cases is being showcased. It features up to
1TB of memory, built to work in tandem across the eight cards of a
regular IO drawer, to support AI model workloads across the
mainframe while designed to consume no more than 75W per card. Each
chip will have 32 compute cores supporting int4, int8, fp8, and
fp16 datatypes for both low-latency and high-throughput AI
applications.
Availability
The Telum II processor will be the central processor powering
IBM's next-generation IBM Z and IBM LinuxONE platforms. It is
expected to be available to IBM Z and LinuxONE clients in 2025. The
IBM Spyre Accelerator, currently in tech preview, is also expected
to be available in 2025.
Statements regarding IBM's future direction and intent are
subject to change or withdrawal without notice, and represent goals
and objectives only.
About IBM
IBM is a leading provider of global hybrid cloud and AI, and
consulting expertise. We help clients in more than 175 countries
capitalize on insights from their data, streamline business
processes, reduce costs and gain the competitive edge in their
industries. Thousands of government and corporate entities in
critical infrastructure areas such as financial services,
telecommunications and healthcare rely on IBM's hybrid cloud
platform and Red Hat OpenShift to affect their digital
transformations quickly, efficiently and securely. IBM's
breakthrough innovations in AI, quantum computing,
industry-specific cloud solutions and consulting deliver open and
flexible options to our clients. All of this is backed by IBM's
long-standing commitment to trust, transparency, responsibility,
inclusivity and service.
Additional Sources
- Read more about the IBM Telum II Processor.
- Read more about the IBM Spyre Accelerator.
- Read more about the IO Accelerator
Media Contact:
Chase Skinner
IBM Communications
chase.skinner@ibm.com
Aishwerya Paul
IBM Communications
aish.paul@ibm.com
1 Source: Morgan Stanley Research,
August 2024.
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