Integration of recently launched Valens chipsets into
cutting-edge machine vision products from Teledyne e2v, Airy3D,
FRAMOS, D3 Embedded, Leopard Imaging, and other companies, marks
Valens' initial penetration into a $460
million Total Addressable Market
HOD HASHARON, Israel, Oct. 1, 2024
/PRNewswire/ -- Today, Valens Semiconductor (NYSE: VLN), a leader
in high-performance connectivity, announced that it will showcase
its innovative chipsets for the industrial machine vision market,
thanks to the exceptional EMC performance and native CSI-2
extension support of the MIPI A-PHY-compliant VA7000, as well as
the USB 3.2 extension capabilities of the VS6320.
Based on a variety of market research, the machine vision market
is set to reach $7.8B by 2029, fueled
by growth in factory and warehouse automation and tighter
inspection regulations. MIPI A-PHY is a strong fit for this market
due to the ability of the technology to be integrated inside the
sensor, leading to smaller, more powerful, less expensive cameras.
Valens estimates that its Total Addressable Market (TAM) in this
segment is expected to reach $460
million by 2029.
"Machine vision is rising across a number of industries, and
Valens is well positioned to capture a significant market share
with two of our most innovative chips – the VA7000 and the VS6320,"
said Gabi Shriki, SVP, Head of
Audio-Video Business at Valens Semiconductor. "We look
forward to seeing our chipsets enabling advanced machine vision
solutions through our growing partnerships in this industry."
Both the VS6320 and VA7000 provide significant value for vision
applications in the industrial market. Designed initially for
automotive, the VA7000 chipset is the first to comply with the MIPI
A-PHY standard for high-performance sensor connectivity. A-PHY's
unique design provides automotive-grade, high-performance
connectivity and enables customers to reduce the power, size, and
cost of cameras – which are all essential for machine vision
applications. The VS6320 is the first ASIC-based USB
3.2 high performance extension solution on the market. Using the
VS6320 chipset removes the key limitation of USB-based industrial
cameras – their short link distance – while maintaining all of
their advantages.
Valens has engaged with leading camera module manufacturers in
industrial machine vision, and its chipsets are powering
cutting-edge products by Teledyne e2v, Airy3D, FRAMOS, D3 Embedded,
Leopard Imaging, and other companies.
Teledyne e2v supports MIPI A-PHY for its Optimom™ range of
turnkey imaging modules. This option paves the way for their use in
specific MIPI applications where the vision processing unit is some
distance away from the module.
"Our Optimom modules are widely used across multiple
industries, and the latest Optimom™ 5D is a groundbreaking solution
that offers both 2D and 3D vision simultaneously," said François
Trolez, Marketing Manager, at Teledyne e2v. "Valens is providing a
state-of-the-art long-distance MIPI connection, using simple,
unshielded cabling. We included A-PHY as an option because of its
flawless EMC performance, as well as its recognition as an industry
standard. This will ensure the reliability of the vision data,
offering an exciting proposition for our robotic and AMR focused
customers and partners."
The new Optimom 5D module features Teledyne e2v's Topaz5D™ image
sensor and offers both 2D vision and 3D depth data outputs. This
unique 5D technology is enabled by IPs and software from
Airy3D.
"Airy3D's DepthIQ single-sensor IP enables machine-vision
applications to be realised where traditional short-range stereo
and time of flight products fall short," said Ron Low, Sr VP Business Development and
Marketing. "Partnering with both Teledyne e2v and Valens
Semiconductor, our combined solutions allow for challenges such as
occlusions, changing light conditions and long reach latency to be
overcome which is an exciting development for the machine-vision
industry going forwards."
FRAMOS, the leading global expert in embedded vision systems,
has added A-PHY sensor module support to its popular FSM and
FSM:GO ecosystem of optical image sensor modules, allowing for
high bandwidth, link distance and cable flexibility.
"At FRAMOS, we take pride in providing our customers with the
most advanced technologies on the market, bringing the best
possible image into the memory of the customer's solution," said
André Brela, Product Manager at FRAMOS. "We've invested in
collaborating with Valens making the adopter module option with the
VA7000 A-PHY chipset available to our joint customers because of
the demand we see in the market for standardized long-reach CSI-2
extension, along with the innovations enabled by this technology,
including cable length, EMC performance, and advanced link
diagnostics."
D3 Embedded, a company specializing in embedded AI imaging
solutions, is integrating the VA7000 chipsets into its camera
modules, allowing for longer link distances and the use of simple,
flexible cabling.
"We were impressed by Valens' ability to do multi-gig link
speeds over unshielded cables and connectors," said Scott Reardon, CEO at D3 Embedded. "This is
something our customers in the Industrial Vehicles and Robotics
market have been looking for and it will open the door to more
optimized embedded vision solutions. We're happy to be working with
Valens to put this innovative product in front of our customers and
partners."
Leopard Imaging, an established supplier of high-performance
machine vision cameras, is offering an A-PHY camera
module tailored for industrial applications.
"We're familiar with the technological advantages that Valens'
A-PHY chipsets bring through our automotive module offering," said
Cliff Cheng, SVP of Marketing at
Leopard Imaging. "A-PHY solves issues we've had in providing high
bandwidth, long distance connectivity will ensuring robust EMC
immunity. We look forward to seeing these camera modules powering
innovative, cross-market solutions."
The Valens' VA7000-based solutions by Teledyne e2v, Airy3D,
FRAMOS, D3 Embedded and Leopard Imaging, as well as the
Valens VS6320, will be showcased at the Valens booth
(10F80) at VISION in Stuttgart, on
October 8-10, 2024.
About Valens Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance
connectivity, enabling customers to transform the digital
experiences of people worldwide. Valens' chipsets are integrated
into countless devices from leading customers, powering
state-of-the-art audio-video installations, next-generation
videoconferencing, and enabling the evolution of ADAS and
autonomous driving. Pushing the boundaries of connectivity, Valens
sets the standard everywhere it operates, and its technology forms
the basis for the leading industry standards such as HDBaseT® and
MIPI A-PHY. For more information, visit
https://www.valens.com/.
Forward-Looking Statements
This press release includes "forward-looking statements" within
the meaning of the "safe harbor" provisions of the United States
Private Securities Litigation Reform Act of 1995. Forward-looking
statements may be identified by the use of words such as
"estimate," "plan," "project," "forecast," "intend," "will,"
"expect," "anticipate," "believe," "seek," "target" or other
similar expressions that predict or indicate future events or
trends or that are not statements of historical matters. These
forward-looking statements include, but are not limited to,
statements regarding our anticipated future results, including
financial results, currency exchange rates, and contract wins, and
future economic and market conditions. These statements are based
on various assumptions, whether or not identified in this press
release, and on the current expectations of Valens Semiconductor's
("Valens") management and are not predictions of actual
performance. These forward-looking statements are provided for
illustrative purposes only and are not intended to serve as and
must not be relied on by any investor as, a guarantee, an
assurance, a prediction or a definitive statement of fact or
probability. Actual events and circumstances are difficult or
impossible to predict and will differ from assumptions. Many actual
events and circumstances are beyond the control of Valens
Semiconductor. These forward-looking statements are subject to a
number of risks and uncertainties, including the cyclicality of the
semiconductor industry; the effect of inflation and a rising
interest rate environment on our customers and industry; the
ability of our customers to absorb inventory; the impact of the
global pandemic caused by COVID-19 on our customers' budgets and on
economic conditions generally, as well as the length, severity of
and pace of recovery following the pandemic; competition in the
semiconductor industry, and the failure to introduce new
technologies and products in a timely manner to compete
successfully against competitors; if Valens fails to adjust its
supply chain volume due to changing market conditions or fails to
estimate its customers' demand; disruptions in relationships with
any one of Valens' key customers; any difficulty selling Valens'
products if customers do not design its products into their product
offerings; Valens' dependence on winning selection processes; even
if Valens succeeds in winning selection processes for its products,
Valens may not generate timely or sufficient net sales or margins
from those wins; sustained yield problems or other delays in the
manufacturing process of products; our ability to effectively
manage, invest in, grow, and retain our sales force, research and
development capabilities, marketing team and other key personnel;
our ability to timely adjust product prices to customers following
price increase by the supply chain; our ability to adjust our
inventory level due to reduction in demand due to inventory buffers
accrued by customers; our expectations regarding the outcome of any
future litigation in which we are named as a party; our ability to
adequately protect and defend our intellectual property and other
proprietary rights; the market price and trading volume of the
Valens ordinary shares may be volatile and could decline
significantly; political, economic, governmental and tax
consequences associated with our incorporation and location in
Israel; and those factors
discussed in Valens' Form 20-F filed with the SEC on February 28, 2024 under the heading "Risk
Factors," and other documents of Valens filed, or to be filed, with
the SEC. If any of these risks materialize or our assumptions prove
incorrect, actual results could differ materially from the results
implied by these forward-looking statements. There may be
additional risks that Valens does not presently know or that Valens
currently believes are immaterial that could also cause actual
results to differ from those contained in the forward-looking
statements. In addition, forward-looking statements reflect Valens'
expectations, plans or forecasts of future events and views as of
the date of this press release. Valens anticipates that subsequent
events and developments may cause Valens' assessments to change.
However, while Valens may elect to update these forward-looking
statements at some point in the future, Valens specifically
disclaims any obligation to do so. These forward-looking statements
should not be relied upon as representing Valens' assessment as of
any date subsequent to the date of this press release. Accordingly,
undue reliance should not be placed upon the forward-looking
statements.
Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
Pat Burek
Senior Vice President
Financial Profiles, Inc.
pburek@finprofiles.com
Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor
michal.benari@valens.com
Lisa Fortuna
Senior Vice President
Financial Profiles, Inc.
lfortuna@finprofiles.com
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