GLW Corning Inc

Dow Corning Launches New Lid-Seal Adhesive for Fast-Growing Flip-Chip Packaging Applications As packages get larger, Dow Corning material helps improve device reliability MIDLAND, Mich., March 1 /PRNewswire/ -- Dow Corning Corporation today introduced DOW CORNING(R) EA-6700 Microelectronic Adhesive, a new lid-seal material based on a unique chemistry that makes it ideally suited for the latest generations of flip-chip semiconductor packages. EA-6700 is the newest adhesive to emerge from Dow Corning's expanding family of packaging materials. Adhesives for lid assembly, also referred to as cap assembly, are integral to the production of flip-chip devices, one of the fastest growing segments of the IC packaging market. In order to ensure device reliability, lid-seal adhesives face the challenge of withstanding high humidity, temperature cycling and extreme operating conditions. EA-6700's unique chemistry improves the long-term reliability of flip-chip devices by offering excellent adhesion, thermal stability and moisture- resistance properties. The proprietary formula lowers outgassing and helps reduce voiding attributed to residual moisture within substrates, leading to improved adhesion to ceramic, organic and other substrates. As with previous generations of Dow Corning adhesives, EA-6700 maintains a low modulus, a key quality that allows it to absorb stress when used between two materials (such as laminate substrates and nickel/copper lids) with differing thermal expansion coefficients. "As flip-chip package designs grow in size, the market is seeing a need for better performing adhesives to ensure the long-term reliability of packaged devices," said Tom Cook, global industry executive director, Dow Corning. "EA-6700 brings together exceptional adhesion and reliability performance that help IC manufacturers achieve their performance goals, especially for high-end chipsets and graphics processors." The market for flip-chip packages is expected to see tremendous growth over the next few years. Market researcher Prismark Partners forecasts unit volumes of flip-chip graphic processors will rise to 137 million in 2008, up from 18 million in 2003. In the same time period, Prismark sees unit volumes of flip-chip chipsets rising to 293 million, up from 94 million. In addition to lid-seal adhesives, Dow Corning offers a suite of thermal interface and wafer-level packaging materials for a variety of flip-chip application needs. About Dow Corning Dow Corning Corporation (http://www.dowcorning.com/electronics) is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technology for all segments of the electronics industry. Dow Corning has development and applications centers strategically located throughout Asia, Europe and the United States. The centers offer advanced resources for electronics materials and services, and are staffed with experienced professionals who can provide technical support to customers locally. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW). More than half of Dow Corning Corporation's sales are outside the United States. DATASOURCE: Dow Corning Corporation CONTACT: Don Piering of Dow Corning, +1-989-496 8972, or ; or Bruce Hokanson of Loomis Group, +1-360-574-4000, or , for Dow Corning

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