GLW Corning Inc

Patent recognizes Dow Corning's significant contributions to development of advanced ICs MIDLAND, Mich., April 17 /PRNewswire-FirstCall/ -- Dow Corning Corporation has been granted a key patent in Japan covering the use of silicon carbide barrier films between dielectric and metal layers found in the world's most advanced semiconductor devices. Dow Corning pioneered the use of silicon carbide barrier technology over 10 years ago, filing the original invention with the United States Patent and Trademark Office in February 1995. Silicon carbide barrier technology is essential in the production of today's leading-edge devices, which use copper dual damascene conductors and low-k dielectric insulators. A silicon carbide barrier layer prevents copper metallic species from diffusing into and contaminating neighboring dielectric film layers in the chip interconnect structure. As a result, chip manufacturers can continue building devices that are smaller and faster than preceding generations. "The issuing of the silicon carbide barrier layer patent in Japan is truly a momentous occasion, providing formal recognition of Dow Corning's innovation and continued contributions to the field of integrated circuit science," said Phil Dembowski, global marketing manager for Dow Corning's Device Fabrication Materials Business. "The patent also provides some level of protection against others who wish to practice or promote this technology without obtaining the appropriate license to do so." Dow Corning has a long history of innovation, and holds a number of other important patents for low-k dielectrics, barrier films and silicon-based lithographic materials, all of which enable the continued development of advanced IC technology. "Dow Corning dedicates a significant portion of resources to the discovery and development of new materials and technology. It's part of our commitment to helping advance the state-of-the-art in IC manufacturing," Dembowski said. The new Japanese patent, number JP 3731932 B, is titled "Silicon Carbide Metal Diffusion Barrier Layer." In the United States, its sister patent (U.S.#5818071) has been formally cited 53 times in support of other U.S. patents, an indicator of the technology's significance. About Dow Corning Dow Corning Corporation (http://www.dowcorning.com/electronics ) is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technology for all segments of the electronics industry. Dow Corning has development and applications centers strategically located throughout Asia, Europe and the United States. The centers offer advanced resources for electronics materials and services, and are staffed with experienced professionals who can provide technical support to customers locally. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW). More than half of Dow Corning Corporation's sales are outside the United States. DATASOURCE: Dow Corning Corporation CONTACT: Company Contact: Don Piering of Dow Corning, +1-989-496-8972, ; or Agency Contact: Bruce Hokanson of Loomis Group, +1-360-574-4000, Web site: http://www.dowcorning.com/electronics

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