Dow Corning and Tokyo Ohka Kogyo Develop Silicon-Infused Bilayer Photoresist, Achieving Higher Etch Selectivity and Simplifying
07 Dezembro 2006 - 10:00AM
PR Newswire (US)
Outgassing Problems Resolved With New Bilayer Photoresist MIDLAND,
Mich., Dec. 7 /PRNewswire/ -- Dow Corning Corp. and Tokyo Ohka
Kogyo Co., Ltd. (TOK) announced today that they have developed and
launched a commercially available bilayer photoresist that uses a
silicon polymer in the imaging layer, thereby improving etch
selectivity to address the demands of 65nm lithography and beyond.
The new photoresist's high silicon content also eliminates the need
for a separate hardmask layer, simplifying sub-65nm processing. The
breakthrough material marks a critical step forward for the
semiconductor industry, both in terms of photoresist technology and
the extension of 193nm lithography. Incorporating Dow Corning's
innovative silicon polymer into TOK's photosensitive material
enables TOK to introduce a new class of photoresist. By eliminating
the hardmask layer and accompanying process steps, the new material
provides a cost-effective solution for sub-65nm lithography. As the
semiconductor industry looks to extend 193nm lithography beyond the
45nm node, thin imaging layers are needed to achieve the necessary
resolution and desired process windows. Increased etch selectivity
is also required to successfully transfer smaller circuit patterns
onto the target wafer. Current photoresists based on organic
chemistries typically don't have the required etch selectivity, so
they are often used in conjunction with several other layers,
including a hardmask layer that provides the necessary etch
resistance. The new photoresist, now available from TOK, also
exhibits no detectable levels of outgassing during the lithography
process. Outgassing, the slow release of chemicals during exposure,
has proved problematic for previous photoresist materials
containing silicon, as the silicon released through outgassing can
contaminate the optics in an exposure tool. "Our joint development
with TOK has accomplished something that no one has been able to do
before: incorporate a silicon polymer in a photosensitive material
and avoid problems with outgassing, which have prevented the use of
silicon in photoresists in the past," said Tomonobu Noguchi,
Electronics & Advanced Technologies marketing director with Dow
Corning. "With next-generation lithography technologies still years
away from commercialization, Dow Corning and TOK are working
together to ensure that optical lithography will be extended beyond
the 65nm node." The jointly developed photoresist has proved
applicable to dry lithography as well as immersion lithography, an
advanced imaging technology that is gaining market acceptance for
the 45nm node and beyond. TOK has successfully achieved a 35nm
line/space pattern using the photoresist under immersion
lithography conditions. Dow Corning and TOK have had a joint
development agreement since 2002 to develop advanced
photolithography materials based on silicon. The collaboration
takes advantage of TOK's sophisticated microprocess technologies
and application expertise in photolithography, with Dow Corning's
innovation and manufacturing capability for silicon-based
materials. The lithography development work is being conducted at
TOK's R&D facilities in Kanagawa, Japan. About Dow Corning Dow
Corning Corporation (http://www.dowcorning.com/electronics) is a
globally integrated provider of materials, application technology
and services, and is focused on providing innovative technology for
all segments of the electronics industry. Dow Corning has
development and applications centers strategically located
throughout Asia, Europe and the United States. The centers offer
advanced resources for electronics materials and services, and are
staffed with experienced professionals who can provide technical
support to customers locally. Dow Corning Corporation is equally
owned by The Dow Chemical Company (NYSE:DOW) and Corning
Incorporated (NYSE:GLW). More than half of Dow Corning
Corporation's sales are outside the United States. About Tokyo Ohka
Kogyo (TOK) Tokyo Ohka Kogyo Co., Ltd. (http://www.tok.co.jp/)
supplies an assortment of manufacturing materials centered around
photoresist used in fabricating semiconductors, flat panel
displays, printed wiring boards and semiconductor packaging, as
well as photolithography-related chemicals. The company also
furnishes equipment that is indispensable for fabricating
leading-edge semiconductors, liquid-crystal-display panels and
semiconductor packaging. In addition, TOK offers photopolymer
plates and pre-sensitized plates, which are in widespread use in
the printing field, as well as high-purity chemicals for use by the
chemistry, electronics, pharmaceuticals, food products, and textile
industries. DATASOURCE: Dow Corning Corp. CONTACT: Don Piering of
Dow Corning, +1-989-496-8972, ; Bruce Hokanson of Loomis Group,
+1-360-574-4000, , for Dow Corning; TOK: Junichi Onodera,
+81-467-75-9667, , or Hiroshi Akama, +81-44-435-3000, Web site:
http://www.dowcorning.com/electronics http://www.tok.co.jp/
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