Dow Corning Electronics Improves Flip-Chip Adhesive Process Speed, Temperature Performance
28 Junho 2007 - 7:48PM
PR Newswire (US)
Adhesives feature two-fold improvement in curing rates, ability to
withstand rework MIDLAND, Mich., June 28 /PRNewswire/ -- Dow
Corning Corp. today introduced two new members of its family of
lid-seal materials for flip-chip semiconductor packages. One offers
a two-fold improvement in cure rate, and another is specifically
formulated for the high temperatures that lead-free assemblies must
endure during rework. The DOW CORNING(R) EA-6800 and the EA- 6900
Microelectronic Adhesives follow the low voiding EA-6700 adhesive
introduced last year. Both materials have been evaluated and
qualified for production use by leading manufacturers, including
Amkor Technology, Inc. Lids, also referred to as heatspreaders, are
integral to the production of flip-chip devices, a fast-growing
segment of the IC packaging market. Lid-seal adhesives must
withstand high humidity, temperature cycling and extreme operating
conditions. These adhesives also must withstand higher processing
temperatures associated with lead-free BGA attach and MSL testing,
due to new Restriction of Use of Certain Hazardous Substances
(RoHS) regulations. All of Dow Corning's lid-seal adhesives are
RoHS compliant, and both the EA- 6800 and EA-6900 offer the
excellent high-temperature performance that is necessary in
processing lead-free assemblies. The EA-6900 Microelectronic
Adhesive is particularly attractive for lead-free applications
because it is specially formulated to withstand repeated exposures
to the high processing temperatures associated with the rework of
lead-free electronic components during board assembly. As for the
EA-6800, it is Dow Corning's first microelectronic adhesive
formulated for fast curing. It cures in approximately 15 minutes,
compared to the typical one hour required for other adhesives, with
no loss of performance, thus offering better throughput and
consequently lower cost. "Our goal at Dow Corning is to have a
complete product line to serve a variety of needs, and that's why
we're expanding our offerings of Microelectronic Adhesives," said
George Toskey, electronics assembly marketing manager for Dow
Corning. "We're focusing on customer needs and requests, and that's
what drove the development of the EA-6800 and the EA-6900." Both
the EA-6800 and the EA-6900 are available now in production
quantities. Like Dow Corning's other adhesive offerings, both have
been thoroughly tested at customer sites. The EA-6800 has been
evaluated and accepted by a leading chip manufacturer and the
EA-6900 has been qualified by Amkor Technology. Based on
proprietary technology, like their predecessors, the EA-6800 and
the EA-6900 adhesive formulas feature reduced voiding from residual
moisture within substrates, which leads to improved adhesion to
ceramic and organic substrates. The adhesives also maintain a low
modulus, a key quality that allows both to absorb thermomechancial
stress when used between two materials (such as laminate substrates
and nickel-plated copper lids) with differing thermal expansion
coefficients. These features make the EA-6800 and the EA- 6900
ideal for high-performance devices that employ flip-chip
technology. Flip-chip is one of the high-growth technologies in
semiconductor packaging. It is an increasingly popular technique in
which the chip is placed face down and its bond pads directly
connected to the substrate with metal studs or solder, thereby
eliminating wire-bonding. The market for flip-chip applications is
poised to expand from 785 million units in 2006 to 1.74 billion
units in 2011, according to market research firm Prismark. About
Dow Corning Dow Corning Corporation
(http://www.dowcorning.com/electronics) is a globally integrated
provider of materials, application technology and services, and is
focused on providing innovative technology for all segments of the
electronics industry. Dow Corning has development and applications
centers strategically located throughout Asia, Europe and the
United States. The centers offer advanced resources for electronics
materials and services, and are staffed with experienced
professionals who can provide technical support to customers
locally. Dow Corning Corporation is equally owned by The Dow
Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW).
More than half of Dow Corning Corporation's sales are outside the
United States. DATASOURCE: Dow Corning Corporation CONTACT: Rhonda
Bovin of Dow Corning, +1-989-496 5489, ; Bruce Hokanson of Loomis
Group, +1-360-574 4000 , for Dow Corning Corporation Web site:
http://www.dowcorning.com/electronics
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