Corning and Soitec to Work Together on the Development of Advanced Substrates for OLED Mobile Displays
30 Julho 2009 - 3:00AM
Business Wire
Corning Incorporated (NYSE:GLW) and the Soitec Group (Euronext
Paris) today announced an agreement to work together on the
development of high-performance silicon-on-glass (SiOG) substrates
for the flat panel mobile display market. The two companies will
focus their efforts on top-performance backplane substrate
technology for organic light-emitting diode (OLED) mobile
displays.
Key challenges to broad commercialization of the high-quality,
cost-effective displays promised by mobile OLED technology,
including backplane electron mobility and uniformity, and lower
total system cost, are being addressed by this codevelopment work.
In turn, outstanding electrical backplane performance should enable
display manufacturers to achieve complex circuit integration and
simplified processing.
“We are pleased to be working with Soitec, a leader in
silicon-on-insulator (SOI) and silicon film transfer technology for
the semiconductor industry,” said Dr. Mark A. Newhouse, senior vice
president and director, New Business Development, Corning
Incorporated. “This co-development work should lead to faster
delivery of our SiOG substrates, which can enable the development
of high-quality, cost-effective OLED displays,” he added.
“This cooperative effort between Corning and Soitec is a natural
extension of both companies’ core competencies. Together we hope to
create low-cost, high-performance substrates for the mobile flat
panel market,” said André-Jacques Auberton-Hervé, president, the
Soitec Group. “In addition to the focus on mobile display
substrates, the codevelopment work can explore alternative
applications for engineered substrates using glass and
semiconductor thin films, which could significantly enlarge our
portfolio of applications.”
Corning's silicon-on-glass technology, currently in development,
is a thin, single-crystal silicon film applied to Corning display
glass. This development is expected to produce an engineered
substrate with outstanding electrical mobility and material
uniformity, upon which electronic circuits can be easily applied by
display manufacturers. The first applications for this technology
are anticipated to be small- to medium-sized mobile display
devices.
Soitec's proprietary Smart Cut™ technology is used to transfer
ultra-thin single crystal layers of wafer substrate material (such
as silicon) onto another surface. This proven technique is used to
fabricate more than 90 percent of SOI production wafers in the
semiconductor industry. Soitec's unique expertise and industrial
capabilities, along with its continuous product and process
improvements, should be key to accelerating SiOG technology for new
market applications.
About Corning Incorporated
Corning Incorporated (www.corning.com) is the world leader in
specialty glass and ceramics. Drawing on more than 150 years of
materials science and process engineering knowledge, Corning
creates and makes keystone components that enable high-technology
systems for consumer electronics, mobile emissions control,
telecommunications and life sciences. Our products include glass
substrates for LCD televisions, computer monitors and laptops;
ceramic substrates and filters for mobile emission control systems;
optical fiber, cable, hardware & equipment for
telecommunications networks; optical biosensors for drug discovery;
and other advanced optics and specialty glass solutions for a
number of industries including semiconductor, aerospace, defense,
astronomy and metrology.
About the Soitec Group
The Soitec Group (www.soitec.com) is the world’s leading
innovator and provider of the engineered substrate solutions that
serve as the foundation for today’s most advanced microelectronic
products. The group leverages its proprietary Smart Cut™ technology
to engineer new substrate solutions, such as silicon-on-insulator
(SOI) wafers, which became the first high-volume application for
this proprietary technology. Since then, SOI has emerged as the
material platform of the future, enabling the production of higher
performing, faster chips that consume less power. Soitec currently
produces more than 90 percent of SOI wafers. Headquartered at
Bernin in France, with two high-volume production units on site and
one in Singapore, Soitec also has offices in the U.S., Japan and
Taiwan.
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