Dow Corning Sees Collaboration in Materials and Processing Technology as Critical to the Semiconductor Industry’s Recovery
09 Julho 2013 - 10:02AM
Business Wire
Semiconductor sales appear to be finally emerging from the red
this year, with moderate but steady growth of 5.1 percent projected
through 2014, according to World Semiconductor Trade Statistics’
Spring 2013 global semiconductor sales forecast. While a revival in
end-market demand is sparking much of this growth, Dow Corning, a
global leader in silicones, silicon-based technology and
innovation, sees collaborative advances in materials and processing
technologies as a sustaining force in the industry’s recovery.
Dow Corning sees collaborative advances
in materials and processing technologies as a sustaining force in
the semiconductor industry's recovery. (Photo: Courtesy of Dow
Corning)
“The pace of innovation across the semiconductor processing and
packaging value chain has never been greater and, while the
industry hasn’t reported any insurmountable challenges ahead for
advancing such promising technologies as 3D IC integration, several
critical needs are emerging among our global semiconductor
customers that we are addressing head on,” said Andrew Ho, global
industry director, Advanced Semiconductor Materials at Dow Corning.
“Among these needs are the steadily accelerating demand for
high-performance silicone solutions to help collaborators along the
value chain to manage the impact of heat and stress, while reducing
overall systems costs wherever possible.”
Specifically, Dow Corning sees growing demand for innovative new
silicone solutions able to address the following industry-wide
challenges:
- Improved heat management: The
trend toward ever-smaller devices with more densely packed
electronic components is coinciding with the expanding use of flip
chip and stacked die architectures. As a result, the industry is
seeking improved thermal management from advanced silicone
technologies that effectively dissipate heat and deliver greater
device reliability and longer life.
- Enhanced stress passivation: The
rapid growth of wafer-level packaging and power electronics is
posing new manufacturing challenges for stress mitigation. At issue
is thermo-mechanical stress failure caused, in part, by
conventional organic passivation materials. This has prompted new
explorations in photopatternable silicone solutions that help
minimize thermo-mechanical stress during processing, and deliver
higher thermal stability and low temperature cure.
- Lower systems costs: Minimizing
total cost of ownership is essential for all semiconductor
manufacturing applications. But it is a key enabler for
next-generation technologies, such as 3D IC integration built on
ultra-thin active wafers. These wafers are temporarily bonded to a
carrier wafer before being thinned; yet most temporary bonding
solutions require costly pre-treatment and specialized chambers.
Recent industry collaborations, however, have successfully fielded
a simpler, more cost-effective temporary bonding solution based on
silicone adhesive and release layers. The breakthrough technology
now enables room-temperature bonding and debonding of active and
carrier wafers using conventional manufacturing methods.
“After decades of serving the semiconductor manufacturing
industry, Dow Corning recognizes that few if any companies can
single-handedly anticipate the next-generation of semiconductor
solutions,” said Ho. “Our strong leadership position in this
industry is directly linked to our long history of close
collaboration with semiconductor manufacturers to develop
breakthrough silicone technologies, and we are committed to
continuing our history of proactively collaborating with customers
to solve their most pressing challenges and help drive the industry
forward.”
About Dow Corning
Dow Corning (dowcorning.com) provides performance-enhancing
solutions to serve the diverse needs of more than 25,000 customers
worldwide. A global leader in silicones, silicon-based technology
and innovation, Dow Corning offers more than 7,000 products and
services via the company’s Dow Corning® and XIAMETER® brands. Dow
Corning is equally owned by The Dow Chemical Company and Corning,
Incorporated. More than half of Dow Corning’s annual sales are
outside the United States. Dow Corning’s global operations adhere
to the American Chemistry Council’s Responsible Care® initiative, a
stringent set of standards designed to advance the safe and secure
management of chemical products and processes.
® Dow Corning is a registered trademark of Dow Corning
Corporation.
® XIAMETER is a registered trademark of Dow Corning
Corporation.
® Responsible Care is a registered service mark of the American
Chemistry Council, Inc.
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Dow Corning Electronics SolutionsMirella Kimpen,
+32.64.888.413mirella.kimpen@dowcorning.comorAH&M
Marketing CommunicationsAaron Wood, +1.413.448.2260,
Extension 470awood@ahminc.com
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