Dow Corning Expands Thermal Interface Material Offerings
09 Março 2004 - 11:00AM
PR Newswire (US)
Dow Corning Expands Thermal Interface Material Offerings Three new
products give electronics industry more choices for controlling
heat in devices MIDLAND, Mich., March 9 /PRNewswire/ -- Dow Corning
Corporation today expanded its base of thermal management solutions
for the electronics industry, introducing three new thermal
interface materials (TIMs). Two of the new materials -- Dow
Corning(R) TP-1600 film series and Dow Corning(R) TP-2400 pad
series -- are the first fabricated TIMs to emerge from Dow Corning
following its strategic acquisition of Tyco Electronics' Raychem
Power Materials Business Unit last year. The thermally conductive
TP-1600 films and TP-2400 pads help customers improve thermal
dissipation in electronic components and assemblies, and are
designed for exceptional ease of use and process flexibility.
Because they are pre-cured, Dow Corning's fabricated TIMs do not
require special application tools, are re-workable and available in
a wide range of thicknesses. They are ideally suited for
electronics applications in the automotive, display, computer and
power markets. For similar heat management needs in high-powered
CPU applications, Dow Corning has introduced Dow Corning(R)
TC-5021, a new thermally conductive grease.As a wet-dispensed
material, the grease enables customers to achieve thin bond lines,
and can be used in high-volume, automated manufacturing
environments. "The introduction of our newest materials marks
another milestone in Dow Corning's strategy tocreate a broad
offering of thermal management choices for our customers," said Tom
Cook, global industry executive director, Dow Corning. "Through key
acquisitions and innovative product development, Dow Corning is
able to offer complete solutions forour customers' thermal
interface needs -- from cost-effective low-performance applications
to today's most complex and demanding heat dissipation challenges."
Dow Corning significantly expanded its line of thermally conductive
materials last year withthe acquisition of Tyco Electronics'
Raychem Power Materials Business Unit. The acquisition added an
extensive suite of fabricated materials to Dow Corning's product
line, and complemented its position as a leading provider of
wet-dispensed TIMs. DowCorning's newest fabricated and
wet-dispensed materials are part of the company's growth strategy
in the TIMs market, which, according to electronics industry market
research firm Prismark, is expected to more than double to $419
million by 2007, up from $170 million in 2002. The market expansion
is driven by a growing need to control heat and electrical
resistance in electronics devices. As these devices get smaller,
faster and less expensive, electronics manufacturers need a broad
selection of thermal management solutions to help them address a
dynamic range of process needs. About Dow Corning Dow Corning
Corporation (http://www.dowcorning.com/electronics ) is a globally
integrated provider of materials, application technology and
services, and is focused on providing innovative technology for all
segments of the electronics industry. Dow Corning has development
and applications centers strategically located throughout Asia,
Europe and the United States. The centers offer advanced resources
for electronics materials and services, and are staffed with
experienced professionals who can provide technical support to
customers locally. Dow Corning Corporation is equally owned by The
Dow Chemical Company (NYSE:DOW) and Corning Incorporated
(NYSE:GLW). More than half of Dow Corning Corporation's sales are
outside the United States. DATASOURCE: Dow Corning Corporation
CONTACT: Don Piering of Dow Corning, +1-989-496-8972, ; or Bruce
Hokanson of Loomis Group, +1-360-574-4000, Website:
http://www.dowcorning.com/electronics
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