Dow Corning and INVINT Collaborate on Electronics Interconnect Technology Development
27 Setembro 2004 - 10:01AM
PR Newswire (US)
Dow Corning and INVINT Collaborate on Electronics Interconnect
Technology Development MIDLAND, Mich., Sept. 27
/PRNewswire-FirstCall/ -- Dow Corning Corporation has signed a
joint development contract with Scotland's INVINT Limited,
specialists in conductive polymer interconnect technology. The
agreement is expected to lead to the development of a variety of
new interconnect technologies for the global electronics industry.
Under the contract, INVINT will develop and characterize novel
interconnect processes based on new Dow Corning conductive polymer
products, including both organic- and silicon-based materials.
Conductive polymer materials are increasingly being used in a wide
range of interconnect applications, from cell phones and smart
cards to military and automotive electronics. The conductive
polymer market is expected to see significant growth over the next
few years, with demand in the United States alone increasing 5.9
percent annually to become a $4.5 billion market in 2008, according
to market researcher The Freedonia Group. "Our collaboration with
INVINT exemplifies the best of Dow Corning's solutions-based
thinking. When developing new products, we're also looking at the
integration and process challenges customers will face when
adopting a new material," said Tom Cook, global industry executive
director, Dow Corning. "Working with a company of INVINT's caliber
will enable us to provide smart, manufacturable processes that help
customers reach their top-line business goals faster and easier
than ever before." "With development of new processing methods,
conductive polymers promise to significantly improve device
performance and make advanced interconnect technologies more cost
effective and efficient," said Bill Matthews, managing director of
INVINT, "We've long seen the potential of conductive polymer
interconnects and are delighted that Dow Corning is bringing its
decades of experience and materials knowledge to bear on this
market." About INVINT INVINT (http://www.invint.com/) was founded
in 2003 to work with hardware, software and materials partners to
develop innovative and cheaper manufacturing techniques for
interconnect applications. Interconnect is a $40 billion industry
that provides the 'glue' that joins components together in
consumer, defense, industrial and automotive electronics. INVINT
owns and develops intellectual property in the use of alternative
materials and processes in this segment. INVINT technology is
delivered to market by a number of methods, from samples costing a
few dollars, through consulting and applications support, to
ongoing six-figure turnkey programs with multinational
organizations. About Dow Corning Dow Corning Corporation
(http://www.dowcorning.com/electronics) is a globally integrated
provider of materials, application technology and services, and is
focused on providing innovative technology for all segments of the
electronics industry. Dow Corning has development and applications
centers strategically located throughout Asia, Europe and the
United States. The centers offer advanced resources for electronics
materials and services, and are staffed with experienced
professionals who can provide technical support to customers
locally. Dow Corning Corporation is equally owned by The Dow
Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW).
More than half of Dow Corning Corporation's sales are outside the
United States. DATASOURCE: Dow Corning Corporation CONTACT:
Company: Don Piering of Dow Corning, +1-989-496 8972, ; or Agency:
Bruce Hokanson of Loomis Group, +1-360-574-4000, Web site:
http://www.dowcorning.com/electronics http://www.invint.com/
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