GLW Corning Inc

Dow Corning Marks Industry First: Introduces Thermally Conductive Dispense-A-Pad New material offers manufacturing breakthrough for automotive electronics market MIDLAND, Mich., Oct. 26 /PRNewswire/ -- In another electronic materials breakthrough, Dow Corning Corporation today introduced the industry's first viable dispensable pad, a new class of thermally conductive materials that combine the manufacturing flexibility of a pad with the dispensability of a wet material. The new Dispense-A-Pad material technology represents a significant advance for the $64 billion automotive electronics market, where automated dispensing equipment is the preferred method of applying thermally conductive materials. Dow Corning developed the new thermally conductive Dispense-A-Pad materials, known as Dow Corning(R) SE 4447CV and SE 4448CV thermally conductive gels, by drawing on its long-time expertise in wet-dispensed materials and growing leadership in fabricated materials. The Dispense-A-Pad is applied using conventional automated equipment, but changes from a wet material into a soft, re-enterable gel-like pad when cured. This unique capability gives electronic component manufacturers the performance benefits of a pad and the cost benefits of automated wet-dispense processes. Target applications in the automotive market include heat management in brake systems, seat controllers and cooling fan modules. This new technology is also expected to yield benefits in other industries, such as computers, communications and medical devices. "For customers who need a dispensable, thermally conductive gel-like pad material, Dow Corning's Dispense-A-Pad technology offers the best of all possible worlds," said Tom Cook, global industry executive director, Dow Corning. "This latest expansion of our thermal product line demonstrates what it means to have Dow Corning on your side: our unique Dispense-A-Pad is just one example of how we're always looking for new ways to help customers achieve their goals." Designed to support a range of gap-fill thickness requirements, the thermally conductive Dispense-A-Pad materials cure at room temperature, are electrically insulating and offer the exceptional distance-holding capabilities typically only found in traditional pads. SE 4447CV offers thermal conductivity of 3.1W/mK and is capable of gap-filling layers from 3 mm up to 5 mm thick. SE 4448CV, with thermal conductivity of 2.2W/mK, typically covers thin layers up to 0.2 mm. Dow Corning's Dispense-A-Pad technology breakthrough marks another milestone in the company's strategy to meet the electronics industry's broad array of thermal management needs. Last year, in a move that complemented its leadership in wet-dispensed materials, Dow Corning acquired Tyco Electronics' Raychem Power Materials Business Unit, adding an extensive suite of fabricated materials to its product portfolio. Dow Corning's thermal product line expanded again earlier this year when the company introduced additional thermal interface materials, including both pads and films for heat management needs in a number of electronic devices. In addition, Dow Corning continues to collaborate with Liquid Control Corp., a leading supplier of dispensing equipment, and other members of its External Equipment Provider Alliance to ensure compatibility between dispensing systems and the new Dispense-A-Pad materials. The work is part of a larger effort at Dow Corning to provide customers with integrated equipment, material and service solutions. "Dow Corning has evolved beyond being a supplier of materials to become a provider of bottom-line solutions that help customers reduce time-to-market, manage risk and minimize costs," Cook said. "For customers, this means Dow Corning is as equally prepared to develop a new material that suits their process exactly as we are to help launch a new manufacturing facility. It's a brand new way of approaching the needs of customers throughout the electronics industry." About Liquid Control Corp. Liquid Control Corp., a pioneer in the design and manufacture of dispensing equipment for single- and multiple-component materials for more than 25 years, is a world leader in application knowledge, technology and experience. Visit http://www.liquidcontrol.com/ to learn more. About Dow Corning Dow Corning Corporation (http://www.dowcorning.com/electronics ) is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technology for all segments of the electronics industry. Dow Corning has development and applications centers strategically located throughout Asia, Europe and the United States. The centers offer advanced resources for electronics materials and services, and are staffed with experienced professionals who can provide technical support to customers locally. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW). More than half of Dow Corning Corporation's sales are outside the United States. DATASOURCE: Dow Corning Corporation CONTACT: Company Contact: Don Piering of Dow Corning, +1-989-496-8972, ; Agency Contact: Bruce Hokanson of Loomis Group, +1-360-574-4000, Web site: http://www.liquidcontrol.com/ http://www.dowcorning.com/electronics

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