Dow Corning Electronics Receives U.S. Patent for New Method of Making Next-Generation Thin Films for Low-k Semiconductor Fabrica
28 Agosto 2007 - 8:00AM
PR Newswire (US)
New Deposition Technology Will Help Chipmakers Produce Better
Insulators, Using Silicon Carbide and Silicon Oxycarbide Films
MIDLAND, Mich., Aug. 28 /PRNewswire/ -- The Advanced Technologies
and Ventures Business for Dow Corning Corporation has been awarded
a U.S. patent on a new method for making low dielectric constant
(low-k) silicon carbide (SiC) and hydrogenated silicon oxycarbide
(H:SiOC) thin films. The method uses a plasma-enhanced chemical
vapor deposition (PECVD) process to react oxygen- providing gas
with cyclic silane compounds that have strained silicon bonds.
Chipmakers have used low-k insulating materials in recent years to
reduce electrical interference between transistors, allowing them
to be placed closer together. That resulted in smaller, faster,
more power-efficient chips. But as semiconductor devices continue
to shrink, conventional low-k films become more prone to damage
from high processing temperatures, and begin to adhere poorly to
the metal layers used for chip interconnections. Dow Corning
expects the new low-k process to be used to produce interlayer
dielectrics in future generations of chips, starting with devices
at the 32 nanometer node. "This patent demonstrates the continuing
advancement of our silicon technology, and our intent to protect
our intellectual property," said Jeroen Bloemhard, global executive
director for Dow Corning's Electronics and Advanced Technologies
Industry. "We intend to remain significant players in the silicon
materials industry, and are investing in research and development
to help us satisfy the market's future needs." Dow Corning's
Advanced Technologies and Ventures Business serves the needs of the
electronics, optoelectronics and semiconductor industries with
specialized, high-purity silicone- and silicon-containing products
and solutions. For more information, visit
http://www.dowcorning.com/content/etronics/etronicschem/default.asp
. About Dow Corning Dow Corning Corporation
(http://www.dowcorning.com/ ) is a globally integrated provider of
materials, application technology and services, and is focused on
providing innovative technologies that help its customers to invent
the future. Dow Corning Corporation is equally owned by The Dow
Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW).
More than half of Dow Corning Corporation's sales are outside the
United States. DATASOURCE: The Advanced Technologies and Ventures
Business for Dow Corning CONTACT: Rhonda Bovin of Dow Corning,
+1-989-496-5489, ; or Bruce Hokanson of the Loomis Group,
+1-360-574-4000, Web site:
http://www.dowcorning.com/content/etronics/etronicschem/default.asp
http://www.dowcorning.com/
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