FREMONT,
Calif., June 20, 2023 /PRNewswire/ -- Lam Research
Corp. (Nasdaq: LRCX) today introduced Coronus DX, the
industry's first bevel deposition solution optimized to address key
manufacturing challenges in next-generation logic, 3D NAND and
advanced packaging applications. As semiconductors continue to
scale, manufacturing becomes increasingly complex with hundreds of
process steps needed to build nanometer-sized devices on a silicon
wafer. In a single step, Coronus DX deposits a proprietary
layer of protective film on both sides of the wafer edge that helps
prevent defects and damage that can often occur during advanced
semiconductor manufacturing. This powerful protection increases
yield and enables chipmakers to implement new leading-edge
processes for the production of next-generation chips. Coronus DX
is the newest addition to the Coronus® product family
and extends Lam's leadership in bevel technology.
"In the era of 3D chipmaking, production is complex and costly,"
said Sesha Varadarajan, senior vice
present of the Global Products Group at Lam Research. "Building on
Lam's expertise in bevel innovation, Coronus DX helps drive more
predictable manufacturing and significantly higher yield, paving
the way for adoption of advanced logic, packaging and 3D NAND
production processes that weren't previously feasible."
Deposition Adds Critical Protection During Process
Integration
Complementing Coronus bevel etch technology,
Coronus DX is a game-changer for chipmakers by enabling new device
structures. Repeated layers of processing can cause residues and
roughness to accumulate along the wafer edge where they may flake
off, drift to other areas, and create defects that cause a
semiconductor device to fail. For example:
- In 3D packaging applications, material from back-end-of-line
can migrate and become a contamination source in future processing.
Roll-off in the wafer edge profile can impact wafer bonding
quality.
- Long wet etch processes in 3D NAND manufacturing may result in
severe substrate damage at the edge.
When those defects cannot be etched away, Coronus DX deposits a
thin dielectric layer of protection on the bevel. This precise and
tunable deposition helps resolve these common issues that may
impact semiconductor quality.
"CEA-Leti applied its expertise in innovative, sustainable
technology solutions to help Lam Research tackle key challenges in
advanced semiconductor manufacturing," said Anne Roule, head of the Semiconductor Platform
Division at CEA-Leti. "By simplifying 3D integration, Coronus DX
drives significantly higher yield and enables chipmakers to adopt
breakthrough production processes."
Proprietary Process Drives Yield Improvement
Coronus
DX enables best-in-class precision wafer centering and process
control, including integrated metrology, to ensure consistency and
repeatability of the process. Coronus products incrementally
increase wafer yield, delivering an additional 0.2 to 0.5 percent
of yield per etch or deposition step, which can result in up to 5
percent improvement across the wafer flow. Manufacturers running
more than 100,000 wafer starts per month may yield millions of
extra die with Coronus – potentially worth millions of dollars –
over the course of a year.
Every Major Chipmaker Uses Coronus
First introduced
in 2007, the Coronus product line is used by every major
semiconductor manufacturer, with several thousand chambers
installed globally. Lam's Coronus product family is the industry's
first mass production-proven bevel technology. Its Coronus and
Coronus HP solutions are etch products designed to prevent defects
by removing layers along the edge. Coronus solutions are used in
the manufacturing of logic, memory and specialty devices, including
leading-edge 3D devices. Coronus DX is now being used in
high-volume manufacturing at leading customer fabs around the
world.
"Improving quality in the production process through
advancements in areas such as bevel technology is essential to our
ability to provide next-generation flash memory at scale to our
customers," said Hideshi Miyajima
(Ph.D.), technology executive of Memory Process at Kioxia
Corporation. "We look forward to continuing to work with Lam
Research and its Coronus solutions to enable leading-edge wafer
production."
Media Resources
- Visit the Lam Newsroom to access a related image.
- Read the Lam Blog.
- Learn more about Lam's bevel deposition research with
CEA-Leti.
About Lam Research
Lam Research Corporation is a
global supplier of innovative wafer fabrication equipment and
services to the semiconductor industry. Lam's equipment and
services allow customers to build smaller and better performing
devices. In fact, today nearly every advanced chip is built with
Lam technology. We combine superior systems engineering, technology
leadership, and a strong values-based culture, with an unwavering
commitment to our customers. Lam Research (Nasdaq: LRCX) is a
FORTUNE 500® company headquartered in Fremont, Calif., with operations around the
globe. Learn more at www.lamresearch.com.
Caution Regarding Forward-Looking
Statements
Statements made in this press release that
are not of historical fact are forward-looking statements and are
subject to the safe harbor provisions created by the Private
Securities Litigation Reform Act of 1995. Such forward-looking
statements relate to, but are not limited to: the complexity of
chip manufacture, the effect that the Coronus DX can have on
predictable manufacturing, on yield and on the adoption of new
processes and new device structures used in chip production; the
cause and effect of residues or roughness on the wafer edge; the
need for predictable results to drive yield enhancement; the
percentage of yield improvement per etch or deposition step, as
well as the total yield improvement across the wafer flow; the
potential number and value of the extra die produced, and Lam's
leadership in bevel technology. Some factors that may affect these
forward-looking statements include: the semiconductor products
(such as chips or die) being produced and their volume and
complexity; the processes being used in that production; the use of
Lam's Coronus tools and the frequency of that use, and
operating conditions in the facility where the chips are being
produced as well as the other risks and uncertainties that are
described in the documents filed or furnished by us with the
Securities and Exchange Commission, including specifically the Risk
Factors described in our annual report on Form 10–K for the fiscal
year ended June 26, 2022 and our
quarterly reports on Form 10-Q for the fiscal quarters ended
December 25, 2022 and March 26, 2023. These uncertainties and changes
could materially affect the forward-looking statements and cause
actual results to vary from expectations in a material way. The
Company undertakes no obligation to update the information or
statements made in this release.
Company Contacts:
Allison L. Parker
Media Relations
(510) 572-9324
publicrelations@lamresearch.com
Ram Ganesh
Investor Relations
(510) 572-1615
investor.relations@lamresearch.com
Source: Lam Research Corporation, (Nasdaq: LRCX)
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